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BSP19AT1/D PDF预览

BSP19AT1/D

更新时间: 2024-11-23 23:35:47
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页数 文件大小 规格书
8页 54K
描述
NPN Silicon Epitaxial Transistor

BSP19AT1/D 数据手册

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ON Semiconductort  
NPN Silicon  
Epitaxial Transistor  
BSP19AT1  
Motorola Preferred Device  
This family of NPN Silicon Epitaxial transistors is designed for use  
as a general purpose amplifier and in switching applications. The  
device is housed in the SOT-223 package which is designed for  
medium power surface mount applications.  
SOT–223 PACKAGE  
NPN SILICON  
HIGH VOLTAGE  
TRANSISTOR  
High Voltage: V  
of 250 and 350 Volts.  
(BR)CEO  
The SOT-223 package can be soldered using wave or reflow.  
SURFACE MOUNT  
SOT-223 package ensures level mounting, resulting in improved  
thermal conduction, and allows visual inspection of soldered joints.  
The formed leads absorb thermal stress during soldering, eliminating  
the possibility of damage to the die  
4
1
2
3
Available in 12 mm Tape and Reel  
COLLECTOR 2,4  
T1 Configuration – 7 inch/1000 unit reel  
T3 Configuration – 13 inch/4000 unit reel  
CASE 318E-04, STYLE 1  
TO-261AA  
BASE  
1
PNP Complement is BSP16T1  
EMITTER 3  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Collector-Emitter Voltage (Open Base)  
Collector-Base Voltage (Open Emitter)  
Emitter-Base Voltage (Open Collector)  
Symbol  
Value  
350  
Unit  
Vdc  
V
CEO  
V
CBO  
V
EBO  
400  
Vdc  
5.0  
Vdc  
Collector Current (DC)  
I
C
1000  
mAdc  
(1)  
Total Power Dissipation @ T = 25°C  
P
0.8  
6.4  
Watts  
mW/°C  
A
D
Derate above 25°C  
Storage Temperature Range  
Junction Temperature  
DEVICE MARKING  
SP19A  
T
stg  
–65 to 150  
150  
°C  
°C  
T
J
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
Unit  
Thermal Resistance from Junction-to-Ambient  
R
156  
°C/W  
θ
JA  
L
Maximum Temperature for Soldering Purposes  
Time in Solder Bath  
T
260  
10  
°C  
Sec  
1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum recommended footprint.  
Preferred devices are ON Semiconductor recommended choices for future use and best overall value.  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
March, 2001 – Rev. 3  
BSP19AT1/D  

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