PD - 97442A
AUIRF7739L2TR
AUIRF7739L2TR1
AUTOMOTIVE GRADE
Automotive DirectFET® Power MOSFET
• Advanced Process Technology
• Optimized for Automotive Motor Drive, DC-DC and
other Heavy Load Applications
• Exceptionally Small Footprint and Low Profile
• High Power Density
V(BR)DSS
40V
700µ
RDS(on) typ.
Ω
Ω
max.
ID (Silicon Limited)
Qg
1000µ
• Low Parasitic Parameters
270A
• Dual Sided Cooling
220nC
• 175°C Operating Temperature
• Repetitive Avalanche Capability for Robustness and
Reliability
• Lead free, RoHS and Halogen free
DirectFET ISOMETRIC
L8
Applicable DirectFET Outline and Substrate Outline
SB
SC
M2
M4
L4
L6
L8
Description
The AUIRF7739L2TR(1) combines the latest Automotive HEXFET® Power MOSFET Silicon technology with the advanced DirectFET® pack-
aging to achieve the lowest on-state resistance in a package that has the footprint of a DPak (TO-252AA) and only 0.7 mm profile. The
DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase,
infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and pro-
cesses. The DirectFET package allows dual sided cooling to maximize thermal transfer in automotive power systems.
This HEXFET® Power MOSFET is designed for applications where efficiency and power density are essential. The advanced DirectFET
packaging platform coupled with the latest silicon technology allows the AUIRF7739L2TR(1) to offer substantial system level savings and
performance improvement specifically in motor drive, high frequency DC-DC and other heavy load applications on ICE, HEV and EV plat-
forms. This MOSFET utilizes the latest processing techniques to achieve low on-resistance and low Qg per silicon area. Additional features of
this MOSFET are 175°C operating junction temperature and high repetitive peak current capability. These features combine to make this
MOSFET a highly efficient, robust and reliable device for high current automotive applications.
Absolute Maximum Ratings
Max.
Parameter
Units
40
V
V
Drain-to-Source Voltage
Gate-to-Source Voltage
V
DS
GS
± 20
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Silicon Limited)
Continuous Drain Current, VGS @ 10V (Package Limited)
Pulsed Drain Current
270
I
I
I
@ T = 25°C
C
D
D
D
190
A
@ T = 100°C
C
46
@ TA = 25°C
ID @ TC = 25°C
375
1070
I
DM
125
Power Dissipation
P
P
@TC = 25°C
@TA = 25°C
D
W
3.8
Power Dissipation
D
EAS
270
160
Single Pulse Avalanche Energy (Thermally Limited)
Single Pulse Avalanche Energy Tested Value
Avalanche Current
mJ
EAS (tested)
IAR
See Fig.12a, 12b, 15, 16
A
EAR
Repetitive Avalanche Energy
mJ
270
T
T
T
Peak Soldering Temperature
P
-55 to + 175
°C
Operating Junction and
J
Storage Temperature Range
STG
Thermal Resistance
Parameter
Typ.
–––
12.5
20
Max.
40
Units
°C/W
W/°C
RθJA
Junction-to-Ambient
RθJA
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Can
–––
–––
1.2
RθJA
RθJCan
RθJ-PCB
–––
–––
Junction-to-PCB Mounted
Linear Derating Factor
0.5
0.83
HEXFET® is a registered trademark of International Rectifier.
www.irf.com
1
10/22/2010