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AUIRFBA1405 PDF预览

AUIRFBA1405

更新时间: 2023-12-06 20:13:19
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
12页 211K
描述
汽车 Q101 55V 单个 N 通道 HEXFET Power MOSFET, 采用 Super 220 封装

AUIRFBA1405 数据手册

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PD-97768  
AUTOMOTIVE GRADE  
AUIRFBA1405  
HEXFET® Power MOSFET  
Features  
l Advanced Planar Technology  
l Low On-Resistance  
l Dynamic dv/dt Rating  
l 175°C Operating Temperature  
l Fast Switching  
l Fully Avalanche Rated  
l Repetitive Avalanche Allowed  
up to Tjmax  
D
V(BR)DSS  
55V  
RDS(on) typ.  
max  
ID (Silicon Limited)  
ID (Package Limited)  
4.3m  
5.0m  
174A  
G
95A  
S
l Lead-Free, RoHS Compliant  
l Automotive Qualified*  
D
Description  
Specifically designed for Automotive applications, this  
Stripe Planar design of HEXFET® Power MOSFETs  
utilizes the latest processing techniques to achieve  
low on-resistance per silicon area. This benefit com-  
bined with the fast switching speed and ruggedized  
device design that HEXFET power MOSFETs are well  
known for, provides the designer with an extremely  
efficient and reliable device for use in Automotive and  
a wide variety of other applications.  
S
D
G
Super-220  
AUIRFBA1405  
G
Gate  
D
Drain  
S
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in the  
specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Max.  
174  
Units  
ID @ TC = 25°C Continuous Drain Current, VGS @ 10V (Silicon Limited)  
123  
ID @ TC = 100°C Continuous Drain Current, VGS @ 10V (Silicon Limited)  
A
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current  
95  
I
@ T = 25°C  
C
D
680  
IDM  
330  
2.2  
PD @TC = 25°C Power Dissipation  
Linear Derating Factor  
W
W/°C  
± 20  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
V
mJ  
A
560  
Single Pulse Avalanche Energy (Thermally Limited)  
Avalanche Current  
See Fig.12a, 12b, 15, 16  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode recovery dv/dt  
Operating Junction and  
mJ  
V/ns  
5.0  
-40 to + 175  
-55 to + 175  
TSTG  
Storage Temperature Range  
°C  
300 (1.6mm from case )  
Soldering Temperature, for 10 seconds  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
0.45  
–––  
58  
Units  
R  
R  
R  
Junction-to-Case  
JC  
CS  
JA  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient  
0.50  
–––  
°C/W  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
03/15/12  

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