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ꢊꢋꢌ ꢍꢎꢏ ꢏ ꢋꢐꢀꢑ ꢒ ꢐꢓ ꢅ ꢋꢐ ꢀ
ꢔ ꢓꢕ ꢊ ꢖ ꢗꢋꢁ ꢘꢒꢐꢈꢓ ꢁ ꢖ ꢎꢕ ꢗ ꢎꢕꢀ
SCES337I − MAY 2000 − REVISED JUNE 2006
SN54LV07A . . . J OR W PACKAGE
SN74LV07A . . . D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
D
D
2-V to 5.5-V V
Operation
CC
Typical V
OLP
(Output Ground Bounce)
= 3.3 V, T = 25°C
<0.8 V at V
CC
A
1A
1Y
2A
2Y
3A
V
1
2
3
4
5
6
7
14
13
12
11
10
9
D
D
D
D
D
Typical V
>2.3 V at V
(Output V
Undershoot)
CC
OHV
CC
OH
6A
6Y
5A
5Y
4A
4Y
= 3.3 V, T = 25°C
A
Outputs Are Disabled During Power Up and
Power Down With Inputs Tied to V
CC
Support Mixed-Mode Voltage Operation on
All Ports
3Y
GND
8
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
SN54LV07A . . . FK PACKAGE
(TOP VIEW)
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
3
2
1 20 19
18
6Y
NC
5A
NC
5Y
2A
NC
2Y
4
5
6
7
8
description/ordering information
17
16
15
14
These hex buffers/drivers are designed for 2-V to
5.5-V V
operation.
NC
3A
CC
The ’LV07A devices perform the Boolean function
Y = A in positive logic.
9 10 11 12 13
The open-drain outputs require pullup resistors to
perform correctly and can be connected to other
open-drain outputs to implement active-low
wired-OR or active-high wired-AND functions.
NC − No internal connection
These devices are fully specified for partial-power-down applications using I . The I circuitry disables the
off
off
outputs, preventing damaging current backflow through the devices when they are powered down.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
Tube of 50
SN74LV07AD
SOIC − D
LV07A
Reel of 2500
Reel of 2000
Reel of 2000
Tube of 90
SN74LV07ADR
SN74LV07ANSR
SN74LV07ADBR
SN74LV07APW
SN74LV07APWR
SN74LV07APWT
SN74LV07ADGVR
SNJ54LV07AJ
SOP − NS
74LV07A
LV07A
SSOP − DB
−40°C to 85°C
Reel of 2000
Reel of 250
Reel of 2000
Tube of 25
TSSOP − PW
LV07A
TVSOP − DGV
CDIP − J
LV07A
SNJ54LV07AJ
SNJ54LV07AW
SNJ54LV07AFK
−55°C to 125°C
CFP − W
Tube of 150
Tube of 55
SNJ54LV07AW
SNJ54LV07AFK
LCCC − FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2006, Texas Instruments Incorporated
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