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1SS404

更新时间: 2024-11-30 07:23:47
品牌 Logo 应用领域
美微科 - MCC 整流二极管开关光电二极管
页数 文件大小 规格书
2页 156K
描述
High Speed Switching Diode

1SS404 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:R-PDSO-G2针数:2
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.70风险等级:5.5
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODEJESD-30 代码:R-PDSO-G2
JESD-609代码:e0元件数量:1
端子数量:2最大输出电流:0.3 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):240
最大功率耗散:0.2 W认证状态:Not Qualified
表面贴装:YES端子面层:TIN LEAD
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:30Base Number Matches:1

1SS404 数据手册

 浏览型号1SS404的Datasheet PDF文件第2页 
M C C  
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20736 Marilla Street Chatsworth  
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ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
1SS404  
Features  
·
High speed switching diode  
Surface Mount  
Fast Reverse Recovery Time: IR=50uA(max.)  
Small Total Capacitance: CT=46pF(typ.)  
Lead Free Finish/RoHS Compliant ("P" Suffix  
designates RoHS Compliant. See ordering information)  
High Speed  
Switching Diode  
Mechanical Data  
SOD-323  
A
·
Marking: S51  
Polarity: Indicated by Cathode Band  
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
B
·
Maximum Ratings @ 25°C Unless Otherwise Specified  
C
E
Maximum (peak) Reverse  
VRM  
25  
20  
V
V
Voltage  
Reverse Voltage  
Maximum (peak) Forward  
Current  
VR  
IFM  
700  
mA  
H
D
Average Forward Current  
Power Dissipation  
Junction Temperature  
Storage Temp. Range  
IO  
PD  
Tj  
TSTG  
300  
200  
150  
mA  
mW  
°C  
(1)  
J
G
-55 to +150  
°C  
DIMENSIONS  
DIM  
INCHES  
MIN  
MM  
NOTE  
MAX  
.107  
.071  
.053  
.045  
.016  
.018  
.010  
.006  
MIN  
2.30  
1.60  
1.15  
0.80  
0.25  
0.10  
0.10  
-----  
MAX  
2.70  
1.80  
1.35  
1.15  
0.40  
0.45  
0.25  
0.15  
A
B
C
D
E
G
H
J
.090  
.063  
.045  
.031  
.010  
.004  
.004  
-----  
Electrical Characteristics @ 25°C Unless Otherwise Specified  
0.16V  
0.22V  
0.38V  
IFM = 1.0mA;  
IFM = 10mA;  
IFM = 300mA;  
Typical Forward Voltage  
VF  
Maximum Reverse  
Current  
Typical Junction  
Capacitance  
VR=20Volts  
TJ = 25°C  
Measured at  
1.0MHz, VR=0V  
IR  
50uA  
46pF  
SUGGESTED SOLDER  
PAD LAYOUT  
CT  
0.074"  
Notes: 1. When mounted on a glass epoxy board PCB: 20mm x 20mm, with copper  
pad 4mm x 4mm.  
0.027”  
0.022”  
www.mccsemi.com  
Revision: A  
2011/01/01  
1 of 2  

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