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SZESD7421N2T5G PDF预览

SZESD7421N2T5G

更新时间: 2024-11-17 11:01:35
品牌 Logo 应用领域
安森美 - ONSEMI 局域网二极管
页数 文件大小 规格书
6页 111K
描述
ESD 保护二极管

SZESD7421N2T5G 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:XDFN2, 2 PIN
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.50Factory Lead Time:4 weeks
风险等级:1.72其他特性:EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE
最大击穿电压:14 V最小击穿电压:10.5 V
击穿电压标称值:10.5 V最大钳位电压:38.1 V
配置:SINGLE二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEJESD-30 代码:R-PBCC-N2
湿度敏感等级:1元件数量:1
端子数量:2最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED极性:BIDIRECTIONAL
最大功率耗散:0.3 W参考标准:AEC-Q101; IEC-61000-4-2
最大重复峰值反向电压:16 V子类别:Transient Suppressors
表面贴装:YES技术:AVALANCHE
端子面层:Nickel/Gold/Palladium (Ni/Au/Pd)端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

SZESD7421N2T5G 数据手册

 浏览型号SZESD7421N2T5G的Datasheet PDF文件第2页浏览型号SZESD7421N2T5G的Datasheet PDF文件第3页浏览型号SZESD7421N2T5G的Datasheet PDF文件第4页浏览型号SZESD7421N2T5G的Datasheet PDF文件第5页浏览型号SZESD7421N2T5G的Datasheet PDF文件第6页 
ESD7421, SZESD7421  
ESD Protection Diodes  
Micro−Packaged Diodes for ESD Protection  
The ESD7421 is designed to protect voltage sensitive components  
from ESD. Excellent clamping capability, low leakage, and fast  
response time provide best in class protection on designs that are  
exposed to ESD. Because of its small size, it is suited for use in cellular  
phones, automotive sensors, infotainment, MP3 players, digital  
cameras and many other applications where board space comes at a  
premium.  
www.onsemi.com  
Pin 1  
Pin 2  
Specification Features  
Low Capacitance 0.3 pF  
Low Clamping Voltage  
Low Leakage 100 nA  
MARKING  
DIAGRAM  
Response Time is < 1 ns  
IEC61000−4−2 Level 4 ESD Protection  
5 M  
G
XDFN2  
(SOD−882)  
CASE 711AM  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
5
= Specific Device Code  
= Date Code  
= Pb−Free Package  
M
G
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
ORDERING INFORMATION  
MAXIMUM RATINGS  
Device  
Package  
Shipping  
Rating  
IEC 61000−4−2 (ESD)  
Symbol  
Value  
Unit  
ESD7421N2T5G  
XDFN2  
8000 /  
Contact  
Air  
12  
15  
kV  
(Pb−Free)  
Tape & Reel  
SZESD7421N2T5G  
XDFN2  
(Pb−Free)  
8000 /  
Tape & Reel  
Total Power Dissipation on FR−5 Board  
°P °  
300  
mW  
D
(Note 1) @ T = 25°C  
A
Thermal Resistance, Junction−to−Ambient  
R
400  
−55 to +150  
260  
°C/W  
°C  
q
JA  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Junction and Storage Temperature Range T , T  
J
stg  
Lead Solder Temperature − Maximum  
(10 Second Duration)  
T
L
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. FR−5 = 1.0 x 0.75 x 0.62 in.  
See Application Note AND8308/D for further description of survivability specs.  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
November, 2016 − Rev. 2  
ESD7421/D  
 

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