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SZESD7481MUT5G PDF预览

SZESD7481MUT5G

更新时间: 2024-11-17 11:01:35
品牌 Logo 应用领域
安森美 - ONSEMI 二极管瞬态抑制器
页数 文件大小 规格书
5页 116K
描述
ESD 保护二极管,低电容,双向

SZESD7481MUT5G 数据手册

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ESD7481MUT5G  
Transient Voltage  
Suppressors  
MicroPackaged Diodes for ESD Protection  
The ESD7481 is designed to protect voltage sensitive components  
that require ultralow capacitance from ESD and transient voltage  
events. Excellent clamping capability, low capacitance, low leakage,  
and fast response time, make these parts ideal for ESD protection on  
designs where board space is at a premium. Because of its low  
capacitance, the part is well suited for use in high frequency designs  
such as USB 2.0 high speed and antenna line applications.  
http://onsemi.com  
1
2
Cathode  
Anode  
Features  
MARKING  
DIAGRAM  
UltraLow Capacitance 0.25 pF  
Low Clamping Voltage  
PIN 1  
Small Body Outline Dimensions: 0.60 mm x 0.30 mm  
Low Body Height: 0.3 mm  
Standoff Voltage: 5.0 V  
X3DFN2  
CASE 152AF  
M
Low Leakage  
Insertion Loss: 0.030 dBm  
Response Time is < 1 ns  
F
= Specific Device Code  
(Rotated 90° clockwise)  
= Date Code  
M
Low Dynamic Resistance < 1 W  
IEC6100042 Level 4 ESD Protection  
ORDERING INFORMATION  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Device  
ESD7481MUT5G  
Package  
Shipping  
Compliant  
X3DFN2  
5000/Tape & Reel  
(PbFree)  
Typical Applications  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
RF Signal ESD Protection  
RF Switching, PA, and Antenna ESD Protection  
Near Field Communications  
MAXIMUM RATINGS  
Rating  
IEC 6100042 (ESD)  
Symbol  
Value  
Unit  
Contact  
Air  
20  
20  
kV  
Total Power Dissipation on FR5 Board  
°P °  
250  
mW  
D
(Note 1) @ T = 25°C  
A
Thermal Resistance, JunctiontoAmbient  
R
400  
40 to +125  
260  
°C/W  
°C  
q
JA  
Junction and Storage Temperature Range  
T , T  
J stg  
Lead Solder Temperature Maximum  
(10 Second Duration)  
T
L
°C  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR5 = 1.0 x 0.75 x 0.62 in.  
See Application Note AND8308/D for further description of survivability specs.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
September, 2012 Rev. 2  
ESD7481/D  
 

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