ESD7481MUT5G
Transient Voltage
Suppressors
Micro−Packaged Diodes for ESD Protection
The ESD7481 is designed to protect voltage sensitive components
that require ultra−low capacitance from ESD and transient voltage
events. Excellent clamping capability, low capacitance, low leakage,
and fast response time, make these parts ideal for ESD protection on
designs where board space is at a premium. Because of its low
capacitance, the part is well suited for use in high frequency designs
such as USB 2.0 high speed and antenna line applications.
http://onsemi.com
1
2
Cathode
Anode
Features
MARKING
DIAGRAM
• Ultra−Low Capacitance 0.25 pF
• Low Clamping Voltage
PIN 1
• Small Body Outline Dimensions: 0.60 mm x 0.30 mm
• Low Body Height: 0.3 mm
• Stand−off Voltage: 5.0 V
X3DFN2
CASE 152AF
M
• Low Leakage
• Insertion Loss: 0.030 dBm
• Response Time is < 1 ns
F
= Specific Device Code
(Rotated 90° clockwise)
= Date Code
M
• Low Dynamic Resistance < 1 W
• IEC61000−4−2 Level 4 ESD Protection
ORDERING INFORMATION
†
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Device
ESD7481MUT5G
Package
Shipping
Compliant
X3DFN2
5000/Tape & Reel
(Pb−Free)
Typical Applications
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
• RF Signal ESD Protection
• RF Switching, PA, and Antenna ESD Protection
• Near Field Communications
MAXIMUM RATINGS
Rating
IEC 61000−4−2 (ESD)
Symbol
Value
Unit
Contact
Air
20
20
kV
Total Power Dissipation on FR−5 Board
°P °
250
mW
D
(Note 1) @ T = 25°C
A
Thermal Resistance, Junction−to−Ambient
R
400
−40 to +125
260
°C/W
°C
q
JA
Junction and Storage Temperature Range
T , T
J stg
Lead Solder Temperature − Maximum
(10 Second Duration)
T
L
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
September, 2012 − Rev. 2
ESD7481/D