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SZESD8704MTWTAG PDF预览

SZESD8704MTWTAG

更新时间: 2023-06-19 14:31:45
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
9页 320K
描述
高速数据线保护,单向 (3.3 V – USB 3.x)

SZESD8704MTWTAG 数据手册

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ESD8704  
ESD Protection Diode  
Low Capacitance Array for High Speed  
Data Lines  
The ESD8704 is designed to protect high speed data lines from  
ESD. Ultra−low capacitance and low ESD clamping voltage make this  
device an ideal solution for protecting voltage sensitive high speed  
data lines. The flow−through style package allows for easy PCB layout  
and matched trace lengths necessary to maintain consistent impedance  
between high speed differential lines such as USB 3.0/3.1.  
www.onsemi.com  
MARKING  
DIAGRAM  
UDFN10  
CASE 517BB  
7DMG  
G
Features  
Low Capacitance (0.5 pF Max, I/O to GND)  
7D = Specific Device Code  
Protection for the Following IEC Standards:  
M
= Date Code  
IEC 61000−4−2 (Level 4)  
Low ESD Clamping Voltage  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
PIN CONFIGURATION  
AND SCHEMATIC  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
N/C N/C GND N/C N/C  
Compliant  
10  
9
8
7
6
Typical Applications  
USB 3.0/3.1  
eSATA  
1
2
3
4
5
I/O I/O GND I/O I/O  
DisplayPort  
I/O  
Pin 1  
I/O  
I/O  
I/O  
Pin 5  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Pin 2 Pin 4  
Rating  
Symbol  
Value  
55 to +125  
55 to +150  
260  
Unit  
°C  
Operating Junction Temperature Range  
Storage Temperature Range  
T
J
T
stg  
°C  
Lead Solder Temperature −  
Maximum (10 Seconds)  
T
L
°C  
Pins 3, 8  
Note: Common GND − Only Minimum of 1 GND connection required  
IEC 61000−4−2 Contact (ESD)  
IEC 61000−4−2 Air (ESD)  
ESD  
ESD  
30  
30  
kV  
kV  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
=
ORDERING INFORMATION  
Device  
Package  
Shipping  
ESD8704MUTAG,  
SZESD8704MUTAG  
UDFN10  
(Pb−Free)  
3000 / Tape &  
Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
See Application Note AND8308/D for further description of  
survivability specs.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
March, 2017 − Rev. 1  
ESD8704/D  

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