Datasheet > SZESD8006MUTAG

SZESD8006MUTAG

更新时间： 2024-11-17 11:01:35

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
12页	1193K
描述
Low Capacitance ESD Protection Diode Array, Thunderbolt

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中文翻译

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SZESD8006MUTAG 数据手册

ESD8006

ESD Protection Diode

Low Capacitance Array for High Speed

Data Lines

The ESD8006 is specifically designed to protect USB 3.0 and

Thunderbolt interfaces from ESD. Ultra−low capacitance and low

ESD clamping voltage make this device an ideal solution for

protecting voltage sensitive high speed data lines. The flow−through

style package allows for easy PCB layout and matched trace lengths

necessary to maintain consistent impedance between high speed

differential lines.

www.onsemi.com

MARKING

DIAGRAM

UDFN8

CASE 517CB

6TMG

Features

• Low Capacitance (0.25 pF Max, I/O to GND)

• Protection for the Following IEC Standards:

IEC 61000−4−2 (Level 4)

• Low ESD Clamping Voltage

6T = Specific Device Code

= Date Code

= Pb−Free Package

(Note: Microdot may be in either location)

• SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

PIN CONFIGURATION

GND

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

Typical Applications

• USB 3.0/3.1

• Thunderbolt

I/O I/O GND I/O I/O GND I/O I/O

• Display Port

MAXIMUM RATINGS (T = 25°C unless otherwise noted)

ORDERING INFORMATION

Rating

Symbol

Value

−55 to +125

−55 to +150

260

Unit

°C

Device

Package

Shipping

Operating Junction Temperature Range

Storage Temperature Range

ESD8006MUTAG

UDFN8

(Pb−Free)

3000 / Tape &

Reel

stg

°C

Lead Solder Temperature −

Maximum (10 Seconds)

°C

SZESD8006MUTAG

UDFN8

(Pb−Free)

3000 / Tape &

Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

IEC 61000−4−2 Contact (ESD)

IEC 61000−4−2 Air (ESD)

ESD

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

See Application Note AND8308/D for further description of

survivability specs.

Publication Order Number:

February, 2015 − Rev. 4

ESD8006/D

12 3 4 5 6 7...12

中文翻译

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