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SZESD9B PDF预览

SZESD9B

更新时间: 2024-02-04 03:39:34
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 129K
描述
Transient Voltage Suppressors

SZESD9B 数据手册

 浏览型号SZESD9B的Datasheet PDF文件第2页浏览型号SZESD9B的Datasheet PDF文件第3页浏览型号SZESD9B的Datasheet PDF文件第4页 
ESD9B, SZESD9B  
Transient Voltage  
Suppressors  
MicroPackaged Diodes for ESD Protection  
The ESD9B Series is designed to protect voltage sensitive  
components from ESD. Excellent clamping capability, low leakage,  
and fast response time provide best in class protection on designs that  
are exposed to ESD. Because of its small size, it is suited for use in  
cellular phones, MP3 players, digital cameras and many other portable  
applications where board space comes at a premium.  
http://onsemi.com  
Specification Features  
Low Capacitance 15 pF  
Low Clamping Voltage  
Small Body Outline Dimensions: 0.039x 0.024(1.0mm x 0.60mm)  
Low Body Height: 0.016(0.4 mm)  
Standoff Voltage: 3.3 V, 5 V  
Low Leakage  
SOD923  
CASE 514AB  
Response Time is < 1 ns  
IEC6100042 Level 4 ESD Protection  
MARKING DIAGRAM  
AECQ101 Qualified and PPAP Capable  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
X M  
This is a PbFree Device  
X
M
= Specific Device Code  
Date Code  
Mechanical Characteristics  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V0  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
ORDERING INFORMATION  
Device  
Package  
Shipping  
ESD9B3.3ST5G  
SOD923 8000/Tape & Reel  
(PbFree)  
MAXIMUM RATINGS  
ESD9B5.0ST5G  
SOD923 8000/Tape & Reel  
(PbFree)  
Rating  
IEC 6100042 (ESD)  
Symbol  
Value  
Unit  
SZESD9B5.0ST5G SOD923 8000/Tape & Reel  
(PbFree)  
Contact  
Air  
18  
18  
kV  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
IEC 6100044 (EFT)  
40  
A
Total Power Dissipation on FR5 Board  
°P °  
300  
mW  
D
(Note 1) @ T = 25°C  
A
Thermal Resistance, JunctiontoAmbient  
R
q
JA  
400  
55 to +150  
260  
°C/W  
°C  
Junction and Storage Temperature Range T , T  
J
stg  
Lead Solder Temperature Maximum  
(10 Second Duration)  
T
°C  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR5 = 1.0 x 0.75 x 0.62 in.  
©
Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
December, 2011 Rev. 2  
ESD9B/D  
 

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