ESD9B, SZESD9B
Transient Voltage
Suppressors
Micro−Packaged Diodes for ESD Protection
The ESD9B Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of its small size, it is suited for use in
cellular phones, MP3 players, digital cameras and many other portable
applications where board space comes at a premium.
http://onsemi.com
Specification Features
• Low Capacitance 15 pF
• Low Clamping Voltage
• Small Body Outline Dimensions: 0.039″ x 0.024″ (1.0mm x 0.60mm)
• Low Body Height: 0.016″ (0.4 mm)
• Stand−off Voltage: 3.3 V, 5 V
• Low Leakage
SOD−923
CASE 514AB
• Response Time is < 1 ns
• IEC61000−4−2 Level 4 ESD Protection
MARKING DIAGRAM
• AEC−Q101 Qualified and PPAP Capable
• SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
X M
• This is a Pb−Free Device
X
M
= Specific Device Code
Date Code
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
ORDERING INFORMATION
†
Device
Package
Shipping
ESD9B3.3ST5G
SOD−923 8000/Tape & Reel
(Pb−Free)
MAXIMUM RATINGS
ESD9B5.0ST5G
SOD−923 8000/Tape & Reel
(Pb−Free)
Rating
IEC 61000−4−2 (ESD)
Symbol
Value
Unit
SZESD9B5.0ST5G SOD−923 8000/Tape & Reel
(Pb−Free)
Contact
Air
18
18
kV
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
IEC 61000−4−4 (EFT)
40
A
Total Power Dissipation on FR−5 Board
°P °
300
mW
D
(Note 1) @ T = 25°C
A
Thermal Resistance, Junction−to−Ambient
R
q
JA
400
−55 to +150
260
°C/W
°C
Junction and Storage Temperature Range T , T
J
stg
Lead Solder Temperature − Maximum
(10 Second Duration)
T
°C
L
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
©
Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
December, 2011 − Rev. 2
ESD9B/D