DATA SHEET
www.onsemi.com
5.5 V ESD Protection Diode
Micro−Packaged Diodes for ESD Protection
X3DFN2 (0201)
CASE 152AF
ESDM3551
The ESDM3551 is designed to protect voltage sensitive components
that require low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast
response time, make these parts ideal for ESD protection on designs
where board space is at a premium.
X2DFN2 (0402)
CASE 714AB
MARKING DIAGRAMS
Features
Low Clamping Voltage
Small Body Outline Dimensions:
− 0201: 0.62 mm x 0.32 mm
− 0402: 1.00 mm x 0.60 mm
PIN 1
M
5
M
= Specific Device Code
= Date Code
Low Body Height: 0.3 mm
Stand−off Voltage: 5.5 V
IEC61000−4−2 Level 4 ESD Protection
JJ M
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
JJ = Specific Device Code
= Date Code
M
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
USB ID Line Protection
mSD Card Protection
Audio Line Protection
GPIO
2
1
ORDERING INFORMATION
MAXIMUM RATINGS
†
Device
Package Shipping
Rating
Symbol
Value
Unit
ESDM3551MXT5G
ESDM3551N2T5G
SZESDM3551N2T5G
X3DFN2
(Pb−Free)
10000 /
Tape & Reel
IEC 61000−4−2 Contact
IEC 61000−4−2 Air
ISO 10605 150 pF/2 kW
ISO 10605 330 pF/2 kW
ISO 10605 330 pF/330 W
ESD
30
30
30
30
30
kV
X2DFN2
(Pb−Free)
8000 / Tape
& Reel
Total Power Dissipation on FR−5 Board
P
D
250
mW
(Note 1) @ T = 25C
A
X2DFN2
(Pb−Free)
8000 / Tape
& Reel
Thermal Resistance, Junction−to−Ambient
R
400
−55 to +150
260
C/W
C
q
JA
Junction and Storage Temperature Range
T , T
J stg
X3DFN2
(Pb−Free)
SZESDM3551MXT5G
10000 /
Tape & Reel
Lead Solder Temperature − Maximum
(10 Second Duration)
T
L
C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of survivability specs.
Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
November, 2022 − Rev. 6
ESDM3551/D