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SZESDR0502BT1G PDF预览

SZESDR0502BT1G

更新时间: 2024-11-03 11:01:35
品牌 Logo 应用领域
安森美 - ONSEMI 二极管瞬态抑制器
页数 文件大小 规格书
4页 124K
描述
ESD 保护二极管,低漏,快速响应时间,带箝位功能

SZESDR0502BT1G 技术参数

是否无铅: 不含铅生命周期:Active
Reach Compliance Code:compliantFactory Lead Time:4 weeks
风险等级:1.54Base Number Matches:1

SZESDR0502BT1G 数据手册

 浏览型号SZESDR0502BT1G的Datasheet PDF文件第2页浏览型号SZESDR0502BT1G的Datasheet PDF文件第3页浏览型号SZESDR0502BT1G的Datasheet PDF文件第4页 
ESDR0502B  
Transient Voltage Suppressor  
ESD Protection Diodes with UltraLow  
Capacitance  
The ESDR0502B is designed to protect voltage sensitive  
components from damage due to ESD in applications that require ultra  
low capacitance to preserve signal integrity. Excellent clamping  
capability, low leakage and fast response time are combined with an  
ultra low diode capacitance of 0.5 pF to provide best in class  
protection from IC damage due to ESD. The small SC75 package is  
ideal for designs where board space is at a premium. The ESDR0502B  
can be used to protect two unidirectional lines or one bidirectional  
line. When used to protect one bidirectional line, the effective  
capacitance is 0.25 pF. Because of its low capacitance, it is well suited  
for protecting high frequency signal lines such as USB2.0 high speed  
and antenna line applications.  
http://onsemi.com  
1
PIN 1. CATHODE  
3
2. CATHODE  
3. ANODE  
2
MARKING  
DIAGRAM  
Specification Features:  
3
Low Capacitance 0.5 pF Typical  
Low Clamping Voltage  
SC75  
CASE 463  
STYLE 4  
AD M G  
G
2
1
Small Body Outline Dimensions:  
0.063” x 0.063” (1.60 mm x 1.60 mm)  
Low Body Height: 0.031(0.8 mm)  
Standoff Voltage: 5 V  
1
AD  
M
G
= Device Code  
= Date Code*  
= PbFree Package  
Low Leakage  
Response Time is Typically < 1.0 ns  
IEC6100042 Level 4 ESD Protection  
This is a PbFree Device  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending  
upon manufacturing location.  
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V0  
ORDERING INFORMATION  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
Device  
ESDR0502BT1G  
Package  
Shipping  
SC75  
(PbFree)  
3000/Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
MAXIMUM RATINGS  
Rating  
IEC 6100042 (ESD)  
Peak Surge Power  
Symbol  
Value  
8.0  
Unit  
kV  
Contact  
(8 x 20 ms)  
(8 x 20 ms)  
P
I
20  
W
pk  
Peak Surge Current  
2.0  
A
DEVICE MARKING INFORMATION  
pp  
See specific marking information in the device marking  
column of the Electrical Characteristics tables starting on  
page 2 of this data sheet.  
Total Power Dissipation on FR5 Board  
P
D
150  
mW  
(Note 1) @ T = 25°C  
A
Storage Temperature Range  
Junction Temperature Range  
T
55 to +150  
55 to +150  
260  
°C  
°C  
°C  
stg  
T
J
Lead Solder Temperature Maximum  
(10 Second Duration)  
T
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR5 = 1.0 x 0.75 x 0.62 in.  
See Application Note AND8308/D for further description of survivability specs.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
June, 2010 Rev. 0  
ESDR0502B/D  
 

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