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SZESD9C5.0ST5G PDF预览

SZESD9C5.0ST5G

更新时间: 2024-11-03 11:01:35
品牌 Logo 应用领域
安森美 - ONSEMI 局域网测试光电二极管瞬态抑制器
页数 文件大小 规格书
3页 39K
描述
ESD Protection Diodes, SOD-923

SZESD9C5.0ST5G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:R-PDSO-F2针数:2
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:5.77
其他特性:EXCELLENT CLAMPING CAPABILITY, LOW CAPACITANCE最小击穿电压:11 V
配置:SINGLE二极管元件材料:SILICON
二极管类型:TRANS VOLTAGE SUPPRESSOR DIODEJESD-30 代码:R-PDSO-F2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE极性:UNIDIRECTIONAL
最大功率耗散:0.15 W参考标准:AEC-Q101, IEC-61000-4-2
最大重复峰值反向电压:5 V最大反向电流:0.5 µA
反向测试电压:5 V表面贴装:YES
技术:AVALANCHE端子面层:Tin (Sn)
端子形式:FLAT端子位置:DUAL
Base Number Matches:1

SZESD9C5.0ST5G 数据手册

 浏览型号SZESD9C5.0ST5G的Datasheet PDF文件第2页浏览型号SZESD9C5.0ST5G的Datasheet PDF文件第3页 
ESD9C3.3ST5G SERIES  
ESD Protection Diodes  
In Ultra Small SOD−923 Package  
The ESD9C3.3ST5G Series is designed to protect voltage sensitive  
components from ESD. Excellent clamping capability, low leakage, and  
fast response time make these parts ideal for ESD protection on designs  
where board space is at a premium. Because of its small size, it is suited  
for use in cellular phones, portable devices, digital cameras, power  
supplies and many other portable applications.  
http://onsemi.com  
1
2
Specification Features:  
PIN 1. CATHODE  
2. ANODE  
Small Body Outline Dimensions:  
0.039x 0.024(1.0 mm x 0.60 mm)  
Low Body Height: 0.016(0.40 mm) Max  
Stand−off Voltage: 3.3 V, 5 V  
Low Leakage  
MARKING  
DIAGRAM  
Response Time < 1 ns  
X M  
SOD−923  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
IEC61000−4−2 Level 4 ESD Protection  
These are Pb−Free Devices  
CASE 514AB  
X
M
= Specific Device Code  
= Date Code  
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V−0  
ORDERING INFORMATION  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
Device  
ESD9CxxST5G  
Package  
Shipping  
SOD−923 8000/Tape & Reel  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
Total Power Dissipation on FR−5 Board  
P  
mW  
D
(Note 1) @ T = 25°C  
150  
A
DEVICE MARKING INFORMATION  
Junction and Storage Temperature  
Range  
T , T  
−55 to +150  
°C  
°C  
J
stg  
See specific marking information in the device marking  
column of the table on page 2 of this data sheet.  
Lead Solder Temperature − Maximum  
(10 Second Duration)  
T
260  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR−5 = 1.0 x 0.75 x 0.62 in.  
©
Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
April, 2007 − Rev. 0  
ESD9C3.3S/D  
 

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