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SZESD7951ST5G PDF预览

SZESD7951ST5G

更新时间: 2023-06-19 14:31:45
品牌 Logo 应用领域
安森美 - ONSEMI 二极管瞬态抑制器
页数 文件大小 规格书
4页 112K
描述
ESD Protection Diode, Low Leakage, Fast Response Time, with Clamping Capability

SZESD7951ST5G 技术参数

是否无铅:不含铅生命周期:Active
Reach Compliance Code:compliantFactory Lead Time:13 weeks
风险等级:5.72Is Samacsys:N
Base Number Matches:1

SZESD7951ST5G 数据手册

 浏览型号SZESD7951ST5G的Datasheet PDF文件第2页浏览型号SZESD7951ST5G的Datasheet PDF文件第3页浏览型号SZESD7951ST5G的Datasheet PDF文件第4页 
ESD7951ST5G  
Transient Voltage  
Suppressors  
ESD Protection Diodes with UltraLow  
Capacitance  
http://onsemi.com  
The ESD7951 is designed to protect voltage sensitive components that  
require ultralow capacitance from ESD and transient voltage events.  
Excellent clamping capability, low capacitance, low leakage, and fast  
response time, make these parts ideal for ESD protection on designs  
where board space is at a premium. Because of its low capacitance, it is  
suited for use in high frequency designs such as USB 2.0 high speed and  
antenna line applications.  
1
2
PIN 1. CATHODE  
2. ANODE  
Specification Features:  
2
Ultra Low Capacitance 0.5 pF  
Low Clamping Voltage  
1
SOD923  
CASE 514AB  
Small Body Outline Dimensions:  
0.039x 0.024(1.00 mm x 0.60 mm)  
Low Body Height: 0.016(0.4 mm)  
Standoff Voltage: 5 V  
Low Leakage  
MARKING DIAGRAM  
Response Time is Typically < 1.0 ns  
IEC6100042 Level 4 ESD Protection  
This is a PbFree Device  
AA M  
1
2
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V0  
AA  
M
= Specific Device Code  
= Date Code  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
ORDERING INFORMATION  
Device  
ESD7951ST5G  
Package  
Shipping  
MAXIMUM RATINGS  
SOD923  
(PbFree)  
8000/Tape & Reel  
Rating  
Symbol  
Value  
Unit  
IEC 6100042 (ESD)  
Contact  
Air  
8
15  
kV  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Total Power Dissipation on FR5 Board  
°P °  
D
150  
mW  
(Note 1) @ T = 25°C  
A
Storage Temperature Range  
Junction Temperature Range  
T
55 to +150  
55 to +125  
260  
°C  
°C  
°C  
stg  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics tables starting on  
page 2 of this data sheet.  
T
J
Lead Solder Temperature Maximum  
(10 Second Duration)  
T
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR5 = 1.0 x 0.75 x 0.62 in.  
See Application Note AND8308/D for further description of survivability specs.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
January, 2011 Rev. 1  
ESD7951S/D  
 

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