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SSM3J36FS PDF预览

SSM3J36FS

更新时间: 2024-11-30 09:04:55
品牌 Logo 应用领域
东芝 - TOSHIBA 晶体开关小信号场效应晶体管光电二极管
页数 文件大小 规格书
5页 185K
描述
Power Management Switches

SSM3J36FS 技术参数

是否Rohs认证:符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.25Is Samacsys:N
配置:SINGLE WITH BUILT-IN DIODE AND RESISTOR最小漏源击穿电压:20 V
最大漏极电流 (ID):0.33 A最大漏源导通电阻:1.31 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
认证状态:Not Qualified表面贴装:YES
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

SSM3J36FS 数据手册

 浏览型号SSM3J36FS的Datasheet PDF文件第2页浏览型号SSM3J36FS的Datasheet PDF文件第3页浏览型号SSM3J36FS的Datasheet PDF文件第4页浏览型号SSM3J36FS的Datasheet PDF文件第5页 
SSM3J36FS  
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type  
SSM3J36FS  
Power Management Switches  
1.5-V drive  
Unit: mm  
Low ON-resistance: R = 3.60 Ω (max) (@V  
= -1.5 V)  
= -1.8 V)  
= -2.8 V)  
= -4.5 V)  
on  
GS  
: R = 2.70 Ω (max) (@V  
on  
GS  
GS  
GS  
: R = 1.60 Ω (max) (@V  
on  
: R = 1.31 Ω (max) (@V  
on  
Absolute Maximum Ratings (Ta = 25 °C)  
Characteristics  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
V
-20  
±8  
V
V
DSS  
Gate-source voltage  
GSS  
DC  
I
-330  
D
Drain current  
mA  
Pulse  
I
-660  
DP  
Drain power dissipation  
Channel temperature  
P
(Note1)  
150  
mW  
°C  
D
T
ch  
150  
T
stg  
55 to 150  
°C  
Storage temperature range  
Note: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
JEDEC  
JEITA  
TOSHIBA  
2-2H1B  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling  
Precautions”/“Derating Concept and Methods”) and individual  
reliability data (i.e. reliability test report and estimated failure rate,  
Weight: 2.4 mg (typ.)  
etc).  
Note1: Mounted on an FR4 board  
(25.4 mm × 25.4 mm × 1.6mm, Cu Pad: 0.36 mm2 ×3)  
Marking  
Equivalent Circuit (top view)  
3
3
P X  
1
2
1
2
Handling Precaution  
When handling individual devices (which are not yet mounted on a circuit board), ensure that the environment is  
protected against static electricity. Operators should wear anti-static clothing, and containers and other objects that come  
into direct contact with devices should be made of anti-static materials.  
Usage Considerations  
Let V be the voltage applied between gate and source that causes the drain current (I ) to below 1 mA for the  
th  
D
SSM3J36FS). Then, for normal switching operation, V  
must be higher than V and V  
must be lower than  
GS(off)  
GS(on)  
th,  
V
This relationship can be expressed as: V < V < V  
GS(off) th GS(on).  
th.  
Take this into consideration when using the device.  
1
2008-06-11  

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