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SN74LVC2G74DCUTG4 PDF预览

SN74LVC2G74DCUTG4

更新时间： 2024-01-25 02:08:05
品牌 Logo 应用领域
德州仪器 - TI 触发器锁存器逻辑集成电路光电二极管
页数 文件大小 规格书
14页 441K
描述
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

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SN74LVC2G74DCUTG4 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOIC
包装说明：VSSOP, TSSOP8,.12,20针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：6 weeks
风险等级：1.28Is Samacsys：N
系列：LVC/LCX/ZJESD-30 代码：R-PDSO-G8
JESD-609代码：e4长度：2.3 mm
逻辑集成电路类型：D FLIP-FLOP最大频率@ Nom-Sup：175000000 Hz
最大I（ol）：0.032 A湿度敏感等级：1
位数：1功能数量：1
端子数量：8最高工作温度：125 °C
最低工作温度：-40 °C输出特性：3-STATE
输出极性：COMPLEMENTARY封装主体材料：PLASTIC/EPOXY
封装代码：VSSOP封装等效代码：TSSOP8,.12,20
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
包装方法：TR峰值回流温度（摄氏度）：260
电源：3.3 V最大电源电流（ICC）：0.01 mA
Prop。Delay @ Nom-Sup：5.9 ns传播延迟（tpd）：14.4 ns
认证状态：Not Qualified座面最大高度：0.9 mm
子类别：FF/Latches最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：1.65 V标称供电电压 (Vsup)：1.8 V
表面贴装：YES技术：CMOS
温度等级：AUTOMOTIVE端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式：GULL WING端子节距：0.5 mm
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
触发器类型：POSITIVE EDGE宽度：2 mm
最小 fmax：200 MHzBase Number Matches：1

SN74LVC2G74DCUTG4 数据手册

 浏览型号SN74LVC2G74DCUTG4的Datasheet PDF文件第2页浏览型号SN74LVC2G74DCUTG4的Datasheet PDF文件第3页浏览型号SN74LVC2G74DCUTG4的Datasheet PDF文件第4页浏览型号SN74LVC2G74DCUTG4的Datasheet PDF文件第5页浏览型号SN74LVC2G74DCUTG4的Datasheet PDF文件第6页浏览型号SN74LVC2G74DCUTG4的Datasheet PDF文件第7页 
SN74LVC2G74  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
WITH CLEAR AND PRESET  
www.ti.com  
SCES203M–APRIL 1999–REVISED FEBRUARY 2007  
FEATURES  
•
Available in the Texas Instruments  
NanoFree™ Package  
•
•
•
•
Typical VOHV (Output VOH Undershoot)  
>2 V at VCC = 3.3 V, TA = 25°C  
•
•
•
•
•
•
Supports 5-V VCC Operation  
Ioff Supports Partial-Power-Down Mode  
Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5.9 ns at 3.3 V  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
ESD Protection Exceeds JESD 22  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
1000-V Charged-Device Model (C101)  
DCT PACKAGE  
(TOP VIEW)  
DCU PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
4 5  
VCC  
PRE  
CLR  
Q
GND  
Q
Q
1
2
3
4
8
7
6
5
CLK  
D
VCC  
1
2
3
4
8
7
6
5
CLK  
D
3 6  
2 7  
1 8  
CLR  
D
PRE  
VCC  
PRE  
CLR  
Q
Q
CLK  
GND  
Q
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the  
other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time  
requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs  
at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval,  
data at the D input can be changed without affecting the levels at the outputs.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000  
SN74LVC2G74YZPR  
_ _ _CP_  
C74_ _ _  
Reel of 3000  
Reel of 3000  
Reel of 250  
SN74LVC2G74DCTR  
SN74LVC2G74DCUR  
SN74LVC2G74DCUT  
–40°C to 85°C  
VSSOP – DCU  
C74_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...14

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SN74LVC2G74DCUTG4 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC2G74DCUTE4 TI

完全替代

 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET
SN74LVC2G74DCUT TI

类似代替

 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET
SN74LVC2G74DCUR TI

类似代替

 SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

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