SN74LVC2G80
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES309E–DECEMBER 2001–REVISED FEBRUARY 2007
FEATURES
•
Available in the Texas Instruments
NanoFree™ Package
>2 V at VCC = 3.3 V, TA = 25°C
•
•
•
Ioff Feature Supports Partial-Power-Down
Mode Operation
•
•
•
•
•
Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 4.2 ns at 3.3 V
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
ESD Protection Exceeds JESD 22
Low Power Consumption, 10-µA Max ICC
–
–
–
2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
•
Typical VOHV (Output VOH Undershoot)
1000-V Charged-Device Model (C101)
DCT PACKAGE
(TOP VIEW)
DCU PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
4 5
GND
2Q
2CLK
VCC
1Q
1
2
3
4
8
7
6
5
1CLK
1D
VCC
1Q
1
2
3
4
8
7
6
5
1CLK
1D
3 6
2 7
1 8
2D
1Q
VCC
1D
2Q
2D
1CLK
GND
2CLK
2Q
2D
GND
2CLK
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without
affecting the levels at the outputs.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
SN74LVC2G80YZPR
_ _ _CX_
–40°C to 85°C
SSOP – DCT
Reel of 3000
Reel of 3000
SN74LVC2G80DCTR
SN74LVC2G80DCUR
C80_ _ _
C80_
VSSOP – DCU
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.