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SN74LVC2G86 PDF预览

SN74LVC2G86

更新时间: 2024-01-25 08:11:27
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德州仪器 - TI 输入元件
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描述
DUAL 2-INPUT EXCLUSIVE OR GATE

SN74LVC2G86 数据手册

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SN74LVC2G86  
DUAL 2-INPUT EXCLUSIVE-OR GATE  
www.ti.com  
SCES360FAUGUST 2001REVISED MAY 2005  
FEATURES  
DCT OR DCU PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
1A  
1B  
2Y  
V
CC  
1
2
3
4
8
7
6
5
Supports 5-V VCC Operation  
1Y  
2B  
2A  
Inputs Accept Voltages to 5.5 V  
Max tpd of 4.7 ns at 3.3 V  
GND  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
Typical VOLP (Output Ground Bounce) <0.8 V  
at VCC = 3.3 V, TA = 25°C  
Typical VOHV (Output VOH Undershoot) >2 V at  
VCC = 3.3 V, TA = 25°C  
4
3
2
1
5
6
7
8
GND  
2Y  
2A  
2B  
1Y  
V
1B  
1A  
Ioff Supports Partial-Power-Down Mode  
Operation  
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This dual 2-input exclusive-OR gate is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC2G86 performs the Boolean function Y = A B or Y = AB + AB in positive logic.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.17-mm Small Bump – YEA  
SN74LVC2G86YEAR  
NanoFree™ – WCSP (DSBGA)  
0.17-mm Small Bump – YZA (Pb-free)  
SN74LVC2G86YZAR  
SN74LVC2G86YEPR  
SN74LVC2G86YZPR  
Reel of 3000  
_ _ _CH_  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
–40°C to 85°C  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000 SN74LVC2G86DCTR  
Reel of 3000 SN74LVC2G86DCUR  
C86_ _ _  
C86_  
VSSOP – DCU  
Reel of 250  
SN74LVC2G86DCUT  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2001–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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