SN74LVC2G80
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
www.ti.com
SCES309C–DECEMBER 2001–REVISED JUNE 2005
FEATURES
DCT OR DCU PACKAGE
(TOP VIEW)
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Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
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Supports 5-V VCC Operation
1CLK
1D
2Q
GND
V
CC
1
2
3
4
8
7
6
5
1Q
2D
2CLK
Inputs Accept Voltages to 5.5 V
Max tpd of 4.2 ns at 3.3 V
Low Power Consumption, 10-µA Max ICC
Typical VOLP (Output Ground Bounce)
< 0.8 V at VCC = 3.3 V, TA = 25°C
YEP OR YZP PACKAGE
(BOTTOM VIEW)
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Typical VOHV (Output VOH Undershoot)
> 2 V at VCC = 3.3 V, TA = 25°C
4
3
2
1
5
6
7
8
GND
2Q
2CLK
2D
Ioff Feature Supports Partial-Power-Down
Mode Operation
1D
1CLK
1Q
V
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
CC
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This dual positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting
the levels at the outputs.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
SN74LVC2G80YEPR
Tape and reel
_ _ _CX_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SN74LVC2G80YZPR
–40°C to 85°C
SSOP – DCT
Tape and reel SN74LVC2G80DCTR
Tape and reel SN74LVC2G80DCUR
C80_ _ _
C80_
VSSOP – DCU
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2001–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.