SN74LVC2G74-Q1
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH CLEAR AND PRESET
www.ti.com
SCES563B–MARCH 2004–REVISED AUGUST 2006
FEATURES
•
Qualification in Accordance With
AEC-Q100
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
(1)
•
•
Qualified for Automotive Applications
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
Customer-Specific Configuration Control Can
Be Supported Along With Major-Change
Approval
– 1000-V Charged-Device Model (C101)
•
•
•
•
•
•
Supports 5-V VCC Operation
DCU PACKAGE
(TOP VIEW)
Inputs Accept Voltages to 5.5 V
Max tpd of 6.9 ns at 3.3 V
VCC
PRE
CLR
Q
1
2
3
4
8
7
6
5
CLK
D
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
Q
Typical VOLP (Output Ground Bounce) <0.8 V
GND
at VCC = 3.3 V, TA = 25°C
•
•
Typical VOHV (Output VOH Undershoot) >2 V at
VCC = 3.3 V, TA = 25°C
Ioff Supports Partial-Power-Down Mode
Operation
(1) Contact factory for details. Q100 qualification data available
on request.
DESCRIPTION/ORDERING INFORMATION
This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.
A low level at the preset (PRE) or clear (CLR) input sets or resets the outputs, regardless of the levels of the
other inputs. When PRE and CLR are inactive (high), data at the data (D) input meeting the setup time
requirements is transferred to the outputs on the positive-going edge of the clock pulse. Clock triggering occurs
at a voltage level and is not related directly to the rise time of the clock pulse. Following the hold-time interval,
data at the D input can be changed without affecting the levels at the outputs.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
C74_
–40°C to 125°C
VSSOP – DCU Reel of 3000
SN74LVC2G74QDCURQ1
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCU: The actual top-side marking has one additional character that designates the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.