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SN74LVC2G74YEAR PDF预览

SN74LVC2G74YEAR

更新时间： 2024-11-03 22:09:51
品牌 Logo 应用领域
德州仪器 - TI 触发器
页数 文件大小 规格书
15页 352K
描述
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET

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SN74LVC2G74YEAR 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：DSBGA包装说明：VFBGA, BGA8,2X4,20
针数：8Reach Compliance Code：not_compliant
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：5.44系列：LVC/LCX/Z
JESD-30 代码：R-XBGA-B8长度：1.9 mm
逻辑集成电路类型：D FLIP-FLOP最大频率@ Nom-Sup：175000000 Hz
最大I（ol）：0.024 A位数：1
功能数量：1端子数量：8
最高工作温度：85 °C最低工作温度：-40 °C
输出特性：3-STATE输出极性：COMPLEMENTARY
封装主体材料：UNSPECIFIED封装代码：VFBGA
封装等效代码：BGA8,2X4,20封装形状：RECTANGULAR
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH包装方法：TAPE AND REEL
峰值回流温度（摄氏度）：NOT SPECIFIED电源：3.3 V
Prop。Delay @ Nom-Sup：5.9 ns传播延迟（tpd）：14.4 ns
认证状态：Not Qualified座面最大高度：0.5 mm
子类别：FF/Latches最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：1.65 V标称供电电压 (Vsup)：1.8 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子形式：BALL
端子节距：0.5 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED触发器类型：POSITIVE EDGE
宽度：0.9 mm最小 fmax：200 MHz
Base Number Matches：1

SN74LVC2G74YEAR 数据手册

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SN74LVC2G74  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
WITH CLEAR AND PRESET  
www.ti.com  
SCES203K–APRIL 1999–REVISED JUNE 2005  
FEATURES  
DCT OR DCU PACKAGE  
(TOP VIEW)  
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
CLK  
D
Q
GND  
V
CC  
1
2
3
4
8
7
6
5
•
•
•
•
•
•
Supports 5-V VCC Operation  
PRE  
CLR  
Q
Inputs Accept Voltages to 5.5 V  
Max tpd of 5.9 ns at 3.3 V  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
4
3
2
1
5
6
7
8
GND  
Q
Q
CLR  
PRE  
•
•
•
•
Typical VOHV (Output VOH Undershoot)  
>2 V at VCC = 3.3 V, TA = 25°C  
D
CLK  
Ioff Supports Partial-Power-Down Mode  
Operation  
V
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoStar™  
WCSP (DSBGA) – YEA  
SN74LVC2G74YEAR  
NanoFree™  
WCSP (DSBGA) – YZA (Pb-free)  
SN74LVC2G74YZAR  
_ _ _CP_  
Reel of 3000  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
SN74LVC2G74YEPR  
–40°C to 85°C  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SN74LVC2G74YZPR  
SSOP – DCT  
Reel of 3000  
Reel of 3000  
Reel of 250  
SN74LVC2G74DCTR  
SN74LVC2G74DCUR  
SN74LVC2G74DCUT  
C74_ _ _  
C74_  
VSSOP – DCU  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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