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SIGC25T120CS2 PDF预览

SIGC25T120CS2

更新时间: 2024-11-21 09:25:35
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率控制双极性晶体管
页数 文件大小 规格书
4页 67K
描述
IGBT Chip in NPT-technology

SIGC25T120CS2 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Not Recommended零件包装代码:DIE
包装说明:UNCASED CHIP, R-XUUC-N3针数:3
Reach Compliance Code:compliant风险等级:5.59
Is Samacsys:N最大集电极电流 (IC):15 A
集电极-发射极最大电压:1200 V配置:SINGLE
门极发射器阈值电压最大值:6.5 V门极-发射极最大电压:20 V
JESD-30 代码:R-XUUC-N3元件数量:1
端子数量:3最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:UNCASED CHIP峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:YES
端子形式:NO LEAD端子位置:UPPER
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICONBase Number Matches:1

SIGC25T120CS2 数据手册

 浏览型号SIGC25T120CS2的Datasheet PDF文件第2页浏览型号SIGC25T120CS2的Datasheet PDF文件第3页浏览型号SIGC25T120CS2的Datasheet PDF文件第4页 
SIGC25T120CS2  
IGBT Chip in NPT-technology  
FEATURES:  
This chip is used for:  
IGBT Modules  
C
E
·
·
·
·
·
1200V NPT technology 175µm chip  
low turn-off losses  
short tail current  
positive temperature coefficient  
easy paralleling  
·
Applications:  
drives, SMPS, resonant  
applications  
G
·
Chip Type  
VCE  
ICn  
Die Size  
Package  
Ordering Code  
SIGC25T120CS2 1200V 15A  
5.71 x 4.53 mm2  
sawn on foil Q67050-A4197  
MECHANICAL PARAMETER:  
mm2  
Raster size  
5.71 x 4.53  
Emitter pad size  
Gate pad size  
2x (2.18 x 1.6)  
1.09 x 0.68  
25.9 / 18.7  
180  
Area total / active  
Thickness  
µm  
mm  
grd  
Wafer size  
150  
Flat position  
270  
Max.possible chips per wafer  
Passivation frontside  
Emitter metallization  
555 pcs  
Photoimide  
3200 nm Al Si 1%  
1400 nm Ni Ag –system  
suitable for epoxy and soft solder die bonding  
Collector metallization  
Die bond  
electrically conductive glue or solder  
Wire bond  
Al, <500µm  
Reject Ink Dot Size  
Æ 0.65mm ; max 1.2mm  
store in original container, in dry nitrogen,  
< 6 month at an ambient temperature of 23°C  
Recommended Storage Environment  
Edited by INFINEON Technologies AI PS DD HV3, L 7141-T, Edition 2, 03.09.2003  

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