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SIGC32T120R3E PDF预览

SIGC32T120R3E

更新时间: 2024-11-25 13:13:31
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率控制双极性晶体管
页数 文件大小 规格书
4页 77K
描述
Insulated Gate Bipolar Transistor

SIGC32T120R3E 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:,
Reach Compliance Code:compliant风险等级:5.59
峰值回流温度(摄氏度):NOT SPECIFIED处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

SIGC32T120R3E 数据手册

 浏览型号SIGC32T120R3E的Datasheet PDF文件第2页浏览型号SIGC32T120R3E的Datasheet PDF文件第3页浏览型号SIGC32T120R3E的Datasheet PDF文件第4页 
SIGC32T120R3  
IGBT3 Chip  
FEATURES:  
·
·
·
·
·
1200V Trench + Field Stop technology  
low turn-off losses  
short tail current  
positive temperature coefficient  
easy paralleling  
This chip is used for:  
· power module  
C
Applications:  
drives  
G
·
E
Chip Type  
VCE  
ICn  
Die Size  
6.5 x 4.87 mm2  
Package  
Ordering Code  
Q67050-  
A4104-A001  
SIGC32T120R3  
1200V 25A  
sawn on foil  
MECHANICAL PARAMETER:  
mm  
Raster size  
6.5 x 4.87  
3.4 x 4.992  
1.139 x 1.139  
31.6 / 21.5  
140  
Emitter pad size  
Gate pad size  
Area total / active  
Thickness  
mm2  
µm  
Wafer size  
150  
mm  
grd  
Flat position  
180  
Max.possible chips per wafer  
Passivation frontside  
Emitter metallization  
454 pcs  
Photoimide  
3200 nm AlSiCu  
1400 nm Ni Ag –system  
suitable for epoxy and soft solder die bonding  
Collector metallization  
Die bond  
electrically conductive glue or solder  
Wire bond  
Al, <500µm  
Reject Ink Dot Size  
Æ 0.65mm ; max 1.2mm  
store in original container, in dry nitrogen,  
< 6 month at an ambient temperature of 23°C  
Recommended Storage Environment  
Edited by INFINEON Technologies AI PS DD HV3, L7641A, Edition 2, 04.09.2003  

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