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SI7844DP-T1-E3 PDF预览

SI7844DP-T1-E3

更新时间: 2024-11-25 20:50:07
品牌 Logo 应用领域
威世 - VISHAY 开关脉冲晶体管
页数 文件大小 规格书
6页 116K
描述
Trans MOSFET N-CH 30V 6.4A 8-Pin PowerPAK SO T/R

SI7844DP-T1-E3 技术参数

是否无铅: 不含铅生命周期:Obsolete
零件包装代码:SOT包装说明:SMALL OUTLINE, R-XDSO-C6
针数:8Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.81
外壳连接:DRAIN配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):6.4 A
最大漏极电流 (ID):6.4 A最大漏源导通电阻:0.022 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-XDSO-C6
JESD-609代码:e3湿度敏感等级:1
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):3.5 W
最大脉冲漏极电流 (IDM):20 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

SI7844DP-T1-E3 数据手册

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Si7844DP  
Vishay Siliconix  
Dual N-Channel 30 V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) ()  
ID (A)  
10  
Definition  
0.022 at VGS = 10 V  
0.030 at VGS = 4.5 V  
TrenchFET® Power MOSFET  
100 % Rg Tested  
30  
8.5  
Compliant to RoHS Directive 2002/95/EC  
PowerPAK® SO-8  
S1  
5.15 mm  
6.15 mm  
1
D
2
D
1
G1  
2
S2  
3
G2  
4
D1  
8
D1  
G
1
G
2
7
D2  
6
D2  
5
Bottom View  
Ordering Information: Si7844DP-T1-E3 (Lead (Pb)-free)  
Si7844DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
S
S
1
2
N-Channel MOSFET  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
30  
20  
V
VGS  
20  
TA = 25 °C  
TA = 70 °C  
10  
6.4  
5.1  
Continuous Drain Current (TJ = 150 °C)a  
ID  
8.0  
A
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)a  
IDM  
IS  
2.9  
3.5  
2.2  
1.1  
1.4  
0.9  
TA = 25 °C  
Maximum Power Dissipationa  
PD  
W
TA = 70 °C  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
TJ, Tstg  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
RthJA  
Typical  
26  
Maximum  
Unit  
t 10 s  
35  
85  
Maximum Junction-to-Ambienta  
Steady State  
Steady State  
60  
°C/W  
RthJC  
Maximum Junction-to-Case (Drain)  
3.9  
5.5  
Notes:  
a. Surface mounted on 1" x 1" FR4 board.  
b. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper  
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not  
required to ensure adequate bottom side solder interconnection.  
c. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 71328  
S10-2606-Rev. E, 15-Nov-10  
www.vishay.com  
1

SI7844DP-T1-E3 替代型号

型号 品牌 替代类型 描述 数据表
SI7844DP-T1-GE3 VISHAY

完全替代

Trans MOSFET N-CH 30V 6.4A 8-Pin PowerPAK SO T/R

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