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SI7384DP PDF预览

SI7384DP

更新时间: 2024-11-02 06:11:35
品牌 Logo 应用领域
威世 - VISHAY 开关
页数 文件大小 规格书
6页 96K
描述
N-Channel Reduced Qg, Fast Switching MOSFET

SI7384DP 数据手册

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Si7384DP  
Vishay Siliconix  
N-Channel Reduced Q , Fast Switching MOSFET  
g
FEATURES  
PRODUCT SUMMARY  
Halogen-free available  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
18  
TrenchFET® Gen II Power MOSFET  
PWM Optimized for High Efficiency  
New Low Thermal Resistance PowerPAK®  
Package with Low 1.07 mm Profile  
100 % Rg Tested  
RoHS  
0.0085 at VGS = 10 V  
0.0125 at VGS = 4.5 V  
COMPLIANT  
30  
14  
APPLICATIONS  
PowerPAK SO-8  
High-Side DC/DC Conversion  
- Notebook  
- Desktop  
- Server  
S
6.15 mm  
5.15 mm  
1
S
2
S
3
G
4
D
D
8
D
7
D
6
D
G
5
Bottom View  
S
N-Channel MOSFET  
Ordering Information: Si7384DP-T1-E3 (Lead (Pb)-free)  
Si7384DP-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Symbol  
10 s  
Steady State  
Unit  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
30  
20  
V
VGS  
TA = 25 °C  
TA = 70 °C  
18  
14  
11  
8
Continuous Drain Current (TJ = 150 °C)a  
ID  
IDM  
IS  
A
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)a  
Avalanche Current  
50  
25  
4.1  
1.5  
IAS  
EAS  
L = 0.1 mH  
Single Pulse Avalanche Energy  
mJ  
W
32  
TA = 25 °C  
TA = 70 °C  
5
1.8  
1.1  
Maximum Power Dissipationa  
PD  
3.2  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)b, c  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
21  
Maximum  
Unit  
t 10 s  
Steady State  
Steady State  
25  
70  
Maximum Junction-to-Ambient (MOSFET)a  
Maximum Junction-to-Case (Drain)  
RthJA  
°C/W  
56  
RthJC  
2.4  
3.0  
Notes:  
a. Surface Mounted on 1” x 1” FR4 board.  
b. See Solder Profile ( http://www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 72656  
S-80439-Rev. C, 03-Mar-08  
www.vishay.com  
1

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