NTLJD3181PZ
Power MOSFET
−20 V, −4.0 A, mCoolt Dual P−Channel,
ESD, 2x2 mm WDFN Package
Features
• WDFN 2x2 mm Package with Exposed Drain Pads for Excellent
http://onsemi.com
Thermal Conduction
• Lowest R
Solution in 2x2 mm Package
V
R
MAX
I
D
MAX (Note 1)
−4.0 A
DS(on)
(BR)DSS
DS(on)
• Footprint Same as SC−88 Package
• Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
• ESD Protected
100 mW @ −4.5 V
144 mW @ −2.5 V
200 mW @ −1.8 V
−20 V
• This is a Pb−Free Device
D1
D2
Applications
• Optimized for Battery and Load Management Applications in
Portable Equipment
• Li−Ion Battery Charging and Protection Circuits
• High Side Load Switch
G1
G2
S1
S2
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
P−CHANNEL MOSFET
P−CHANNEL MOSFET
Parameter
Drain−to−Source Voltage
Symbol
Value
−20
8.0
Unit
V
V
DSS
MARKING
DIAGRAM
D2
D1
Gate−to−Source Voltage
V
GS
V
Continuous Drain
Current (Note 1)
I
A
T = 25°C
−3.2
−2.3
−4.0
1.5
1
2
3
6
5
4
D
A
WDFN6
CASE 506AN
Steady
State
JEMG
T = 85°C
A
G
Pin 1
t ≤ 5 s
T = 25°C
A
JE = Specific Device Code
Power Dissipation
(Note 1)
P
W
Steady
State
M
G
= Date Code
= Pb−Free Package
D
T = 25°C
A
(Note: Microdot may be in either location)
t ≤ 5 s
2.3
Continuous Drain
Current (Note 2)
I
A
T = 25°C
−2.2
−1.6
0.71
D
A
PIN CONNECTIONS
T = 85°C
A
Steady
State
D1
Power Dissipation
(Note 2)
P
W
D
T = 25°C
A
S1
G1
D2
D1
1
2
3
6
5
4
Pulsed Drain Current
t = 10 ms
I
−16
A
p
DM
G2
S2
Operating Junction and Storage Temperature T , T
−55 to
150
°C
J
STG
D2
Source Current (Body Diode) (Note 2)
I
−1.0
A
S
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
(Top View)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
†
Device
Package
Shipping
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
NTLJD3181PZTAG
WDFN6 3000/Tape & Reel
(Pb−Free)
2. Surface Mounted on FR4 Board using the minimum recommended pad size
2
NTLJD3181PZTBG
WDFN6 3000/Tape & Reel
(Pb−Free)
of 30 mm , 2 oz Cu.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2008
1
Publication Order Number:
December, 2008 − Rev. 0
NTLJD3181PZ/D