Datasheet > NTLJD4116N

NTLJD4116N

更新时间： 2024-11-01 06:00:43

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
7页	81K
描述
Power MOSFET

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NTLJD4116N 数据手册

NTLJD4116N

Power MOSFET

30 V, 4.6 A, mCoolt Dual N−Channel,

2x2 mm WDFN Package

Features

• WDFN Package Provides Exposed Drain Pad for Excellent Thermal

Conduction

http://onsemi.com

• 2x2 mm Footprint Same as SC−88

MAX

I MAX (Note 1)

(BR)DSS

DS(on)

• Lowest R

• 1.5 V R

Solution in 2x2 mm Package

DS(on)

70 mW @ 4.5 V

90 mW @ 2.5 V

125 mW @ 1.8 V

250 mW @ 1.5 V

Rating for Operation at Low Voltage Gate Drive Logic

DS(on)

30 V

4.6 A

Level

• Low Profile (< 0.8 mm) for Easy Fit in Thin Environments

• This is a Pb−Free Device

Applications

• DC−DC Converters (Buck and Boost Circuits)

• Low Side Load Switch

• Optimized for Battery and Load Management Applications in

Portable Equipment such as, Cell Phones, PDA’s, Media Players, etc.

• Level Shift for High Side Load Switch

N−CHANNEL MOSFET

MAXIMUM RATINGS (T = 25°C unless otherwise noted)

MARKING

DIAGRAM

Parameter

Drain−to−Source Voltage

Symbol

Value

Unit

DSS

WDFN6

CASE 506AN

JFMG

Gate−to−Source Voltage

8.0

3.7

2.7

4.6

1.5

Continuous Drain

Current (Note 1)

T = 25°C

Steady

State

T = 85°C

JF = Specific Device Code

= Date Code

= Pb−Free Package

t ≤ 5 s

T = 25°C

Power Dissipation

(Note 1)

Steady

State

(Note: Microdot may be in either location)

T = 25°C

t ≤ 5 s

2.3

2.5

PIN CONNECTIONS

Continuous Drain

Current (Note 2)

T = 25°C

T = 85°C

1.8

Steady

State

Power Dissipation

(Note 2)

0.71

T = 25°C

Pulsed Drain Current

t = 10 ms

Operating Junction and Storage Temperature T , T

−55 to

150

°C

STG

Source Current (Body Diode) (Note 2)

2.0

(Top View)

Lead Temperature for Soldering Purposes

(1/8″ from case for 10 s)

260

°C

ORDERING INFORMATION

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

†

Device

Package

Shipping

NTLJD4116NT1G

WDFN6

3000/Tape & Reel

(Pb−Free)

1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq

[2 oz] including traces).

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

2. Surface Mounted on FR4 Board using the minimum recommended pad size

of 30 mm , 2 oz Cu.

Semiconductor Components Industries, LLC, 2006

Publication Order Number:

May, 2006 − Rev. 4

NTLJD4116N/D

12 3 4 5 6 7

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