NTF3055−100
Preferred Device
Power MOSFET
3.0 Amps, 60 Volts
N−Channel SOT−223
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
http://onsemi.com
3.0 A, 60 V
Features
RDS(on) = 110 mW
• Pb−Free Packages are Available
N−Channel
D
Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
MARKING
DIAGRAM
& PIN
Rating
Drain−to−Source Voltage
Symbol Value
Unit
Vdc
Vdc
4
V
DSS
60
60
ASSIGNMENT
1
Drain−to−Gate Voltage (R = 10 MW)
V
DGR
Drain
4
GS
2
3
Gate−to−Source Voltage
− Continuous
SOT−223
CASE 318E
STYLE 3
V
GS
20
30
Vdc
Vpk
AWW
− Non−repetitive (t ≤ 10 ms)
p
3055 G
G
Drain Current
− Continuous @ T = 25°C
I
3.0
1.4
9.0
Adc
Apk
A
D
D
− Continuous @ T = 100°C
− Single Pulse (t ≤ 10 ms)
I
A
1
2
3
I
p
DM
Gate Drain Source
Total Power Dissipation @ T = 25°C (Note 1)
P
2.1
1.3
W
W
A
D
A
= Assembly Location
= Work Week
= Specific Device Code
= Pb−Free Package
Total Power Dissipation @ T = 25°C (Note 2)
A
WW
3055
G
0.014 W/°C
Derate above 25°C
Operating and Storage Temperature Range
T , T
J
−55
to 175
°C
stg
(Note: Microdot may be in either location)
Single Pulse Drain−to−Source Avalanche
E
AS
74
mJ
ORDERING INFORMATION
Energy − Starting T = 25°C
J
(V = 25 Vdc, V = 10 Vdc,
†
DD
GS
Device
Package
Shipping
I (pk) = 7.0 Apk, L = 3.0 mH, V = 60 Vdc)
L
DS
NTF3055−100T1
SOT−223 1000/Tape & Reel
Thermal Resistance
°C/W
°C
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
R
R
72.3
114
q
JA
JA
1000/Tape & Reel
SOT−223
(Pb−Free)
NTF3055−100T1G
q
Maximum Lead Temperature for Soldering
T
260
L
NTF3055−100T3
SOT−223 4000/Tape & Reel
Purposes, 1/8″ from case for 10 seconds
NTF3055−100T3G SOT−223 4000/Tape & Reel
(Pb−Free)
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
NTF3055−100T3LF SOT−223 4000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. When surface mounted to an FR4 board using 1″ pad size, 1 oz.
(Cu. Area 1.127 sq in).
2. When surface mounted to an FR4 board using minimum recommended pad
size, 2−2.4 oz. (Cu. Area 0.272 sq in).
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 3
NTF3055−100/D