NJT4030P, NJV4030P
Bipolar Power Transistors
PNP Silicon
Features
• Epoxy Meets UL 94, V−0 @ 0.125 in
http://onsemi.com
• NJV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
PNP TRANSISTOR
3.0 AMPERES
40 VOLTS, 2.0 WATTS
COLLECTOR 2,4
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
Rating
Symbol
Value
40
Unit
Vdc
Vdc
Vdc
Adc
Adc
Adc
V
BASE
1
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
V
CEO
V
40
CB
EB
EMITTER 3
V
6.0
1.0
3.0
5.0
3B
MARKING
DIAGRAM
Base Current − Continuous
Collector Current − Continuous
Collector Current − Peak
ESD − Human Body Model
ESD − Machine Model
I
B
C
4
I
1
2
I
3
CM
AYW
SOT−223
CASE 318E
STYLE 1
4030PG
HBM
MM
1
C
V
A
Y
W
= Assembly Location
Year
= Work Week
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
4030P = Specific Device Code
G
= Pb−Free Package
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
ORDERING INFORMATION
Total Power Dissipation
P
W
D
†
Device
Package
Shipping
Total P @ T = 25°C (Note 1)
2.0
D
A
Total P @ T = 25°C (Note 2)
0.80
D
A
NJT4030PT1G
NJV4030PT1G
SOT−223
(Pb−Free)
1000 / Tape &
Reel
Thermal Resistance, Junction−to−Case
Junction−to−Ambient (Note 1)
Junction−to−Ambient (Note 2)
°C/W
R
R
64
155
q
q
JA
JA
NJT4030PT3G
NJV4030PT3G
SOT−223
(Pb−Free)
4000 / Tape &
Reel
Maximum Lead Temperature for Soldering
Purposes, 1/8” from case for 5 seconds
T
260
°C
°C
L
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Operating and Storage Junction
Temperature Range
T , T
J
−55 to
+150
stg
1. Mounted on 1” sq. (645 sq. mm) Collector pad on FR−4 bd material.
2. Mounted on 0.012” sq. (7.6 sq. mm) Collector pad on FR−4 bd material.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
November, 2013 − Rev. 5
NJT4030P/D