NDF03N60Z, NDP03N60Z,
NDD03N60Z
N-Channel Power MOSFET
600 V, 3.3 W
Features
http://onsemi.com
• Low ON Resistance
• Low Gate Charge
• 100% Avalanche Tested
• These Devices are Pb−Free and are RoHS Compliant
V
R
(TYP) @ 1.2 A
DS(on)
DSS
600 V
3.3 W
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
Rating
Symbol
V
NDF
NDP
600
3.0
NDD
Unit
V
N−Channel
D (2)
Drain−to−Source Voltage
DSS
Continuous Drain Current
R
I
D
3.0
(Note 1)
2.6
1.65
10
A
q
JC
Continuous Drain Current
I
D
1.9
(Note 1)
1.9
12
A
A
R
q
JC
T = 100°C
A
G (1)
Pulsed Drain Current, V
@ 10 V
I
12
(Note 1)
GS
DM
Power Dissipation R
P
25
78
30
61
W
V
q
JC
D
S (3)
Gate−to−Source Voltage
V
GS
Single Pulse Avalanche
E
AS
100
mJ
Energy, I = 3.0 A
D
ESD (HBM)
V
3000
V
V
esd
(JESD 22−A114)
4
RMS Isolation Voltage (t =
V
ISO
4500
0.3 sec., R.H. ≤ 30%,
4
T = 25°C) (Figure 17)
A
Peak Diode Recovery
dv/dt
4.5 (Note 2)
3.0
V/ns
A
2
1
1
1
2
1
2
Continuous Source Current
(Body Diode)
I
S
3
2
3
3
3
DPAK
CASE 369AA
STYLE 2
TO−220FP TO−220AB
CASE 221D CASE 221ACASE 369D
STYLE 1 STYLE 5
STYLE 2
IPAK
Maximum Temperature for
Soldering Leads
T
L
260
°C
°C
Operating Junction and
Storage Temperature Range
T , T
−55 to 150
J
stg
MARKING AND ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Limited by maximum junction temperature
2. I = 3.0 A, di/dt ≤ 100 A/ms, V ≤ BV
, T = +150°C
J
SD
DD
DSS
© Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
April, 2010 − Rev. 3
NDF03N60Z/D