NDD03N80Z, NDF03N80Z
N‐Channel Power MOSFET
800 V, 4.5 W
Features
• ESD Diode−Protected Gate
• 100% Avalanche Tested
http://onsemi.com
R MAX
DS(ON)
• 100% Rg Tested
• These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS
V
Compliant
(BR)DSS
800 V
4.5 W @ 10 V
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
Rating
Drain−to−Source Voltage
Continuous Drain Current R
Symbol NDD
V
NDF
800
Unit
V
N-Channel
DSS
D (2)
I
D
2.9
3.3
(Note 1)
A
q
JC
Continuous Drain Current
I
D
1.9
2.1
(Note 1)
A
R
, T = 100°C
q
JC
A
Pulsed Drain Current, V @ 10 V
I
12
96
13
25
A
W
V
G (1)
GS
DM
Power Dissipation R
P
D
q
JC
Gate−to−Source Voltage
V
30
GS
S (3)
Single Pulse Avalanche Energy, I
2.5 A
=
E
AS
100
mJ
D
ESD (HBM) (JESD22−A114)
V
2300
4500
V
V
esd
RMS Isolation Voltage (t = 0.3 sec.,
V
ISO
4
R.H. ≤ 30%, T = 25°C) (Figure 14)
A
Peak Diode Recovery (Note 2)
dv/dt
4.5
3.3
V/ns
A
Continuous Source Current
(Body Diode)
I
S
1
2
3
1
2
3
Maximum Temperature for Soldering
Leads
T
260
°C
°C
L
NDD03N80Z−1G
IPAK
CASE 369D
NDF03N80ZH
TO−220FP
CASE 221AH
Operating Junction and
Storage Temperature Range
T , T
−55 to 150
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
4
2
1
3
1. Limited by maximum junction temperature
NDD03N80ZT4G
DPAK
2. I = 3.3 A, di/dt ≤ 100 A/ms, V ≤ BV
, T = +150°C
S
DD
DSS
J
CASE 369AA
MARKING AND ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
1
Publication Order Number:
August, 2012 − Rev. 0
NDD03N80Z/D