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NDD04N62Z-1G

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品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
9页 150K
描述
N-Channel Power MOSFET 620 V, 1.8 

NDD04N62Z-1G 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:ROHS COMPLIANT, CASE 369D-01, IPAK-3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.84Is Samacsys:N
雪崩能效等级(Eas):120 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:620 V
最大漏极电流 (Abs) (ID):4.1 A最大漏极电流 (ID):4.1 A
最大漏源导通电阻:2 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSIP-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):83 W最大脉冲漏极电流 (IDM):16 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NDD04N62Z-1G 数据手册

 浏览型号NDD04N62Z-1G的Datasheet PDF文件第2页浏览型号NDD04N62Z-1G的Datasheet PDF文件第3页浏览型号NDD04N62Z-1G的Datasheet PDF文件第4页浏览型号NDD04N62Z-1G的Datasheet PDF文件第5页浏览型号NDD04N62Z-1G的Datasheet PDF文件第6页浏览型号NDD04N62Z-1G的Datasheet PDF文件第7页 
NDF04N62Z, NDP04N62Z,  
NDD04N62Z  
N-Channel Power MOSFET  
620 V, 1.8 W  
Features  
http://onsemi.com  
Low ON Resistance  
Low Gate Charge  
100% Avalanche Tested  
V
R
(TYP) @ 2 A  
DS(ON)  
DSS  
These Devices are PbFree and RoHS Compliant  
620 V  
1.8 Ω  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
NChannel  
Parameter  
Symbol  
V
NDF  
NDP  
620  
NDD Unit  
D (2)  
DraintoSource Voltage  
V
DSS  
Continuous Drain Current  
R
I
4.4  
(Note 2)  
4.4  
4.1  
2.6  
16  
A
D
q
JC  
Continuous Drain Current  
I
D
2.8  
(Note 2)  
2.8  
18  
96  
A
R
q
JC  
, T = 100°C  
A
G (1)  
Pulsed Drain Current,  
@ 10V  
I
18  
(Note 2)  
A
DM  
V
GS  
S (3)  
Power Dissipation R  
(Note 1)  
P
D
28  
83  
W
q
JC  
GatetoSource Voltage  
V
GS  
30  
V
Single Pulse Avalanche  
E
AS  
120  
mJ  
Energy, I = 4.0 A  
D
ESD (HBM) (JESD22A114)  
V
3000  
V
V
esd  
4
RMS Isolation Voltage  
V
ISO  
4500  
(t = 0.3 sec., R.H. 30%,  
4
T = 25°C) (Figure 14)  
A
2
1
Peak Diode Recovery  
dv/dt  
4.5 (Note 3)  
4.0  
V/ns  
A
1
1
2
1
2
3
2
3
3
Continuous Source Current  
(Body Diode)  
I
S
3
DPAK  
TO220FP TO220AB  
IPAK  
CASE 369AA  
STYLE 2  
CASE 221D CASE 221A  
STYLE 1  
CASE 369D  
STYLE 5  
STYLE 2  
Maximum Temperature for  
Soldering Leads, 0.063″  
(1.6 mm) from Case for  
10 s Package Body for 10 s  
T
300  
260  
°C  
L
T
PKG  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
Operating Junction and  
Storage Temperature Range  
T , T  
55 to 150  
°C  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1sq. pad size (Cu area = 1.127 in sq  
[2 oz] including traces).  
2. Limited by maximum junction temperature  
3. I = 4.0 A, di/dt 100 A/ms, V BV  
, T = +150°C  
J
SD  
DD  
DSS  
This document contains information on some products that are still under development.  
ON Semiconductor reserves the right to change or discontinue these products without  
notice.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
April, 2010 Rev. 1  
NDF04N62Z/D  
 

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