NDF04N60Z, NDP04N60Z,
NDD04N60Z
N-Channel Power MOSFET
1.8 W, 600 Volts
Features
http://onsemi.com
• Low ON Resistance
• Low Gate Charge
• 100% Avalanche Tested
• These Devices are Pb−Free and are RoHS Compliant
V
R
(TYP) @ 2 A
DS(ON)
DSS
600 V
1.8 Ω
Applications
• Adapter (Notebook, Printer, Gaming)
• LCD Panel Power
• Lighting Ballasts
4
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
C
4
Rating
Symbol
NDF
600 (Note 1)
4.0 (Note 2)
NDD/NDP Unit
Drain−to−Source Voltage
Continuous Drain Current
Continuous Drain Current
V
DSS
V
A
A
2
1
1
1
1
2
2
3
2
I
I
D
3
3
3
DPAK
TO−220FP TO−220AB
CASE 221D CASE 221A CASE 369D
STYLE 1 STYLE 5
STYLE 2
IPAK
2.7 (Note 2)
D
CASE 369AA
STYLE 2
T = 100°C
A
Pulsed Drain Current, V @ 10V
I
14 (Note 2)
A
W
V
GS
DM
Power Dissipation (Note 1)
Gate−to−Source Voltage
P
28
95
D
MARKING DIAGRAMS
V
30
51
GS
4
Drain
Single Pulse Avalanche Energy,
E
mJ
AS
L = 6.4 mH, I = 4.0 A
D
ESD (HBM) (JESD 22−114−B)
V
2500
V
V
esd
RMS Isolation Voltage (t = 0.3
V
ISO
4500
−
NDF04N60ZG
sec., R.H. ≤ 30%, T = 25°C)
or
A
(Figure 13)
NDP04N60ZG
AYWW
Peak Diode Recovery
dv/dt
4.5 (Note 3)
4.0
V/ns
A
Gate
Source
1
2
3
Continuous Source Current
(Body Diode)
I
S
4
Gate Drain Source
Drain
Maximum Temperature for
Soldering Leads, 0.063″
(1.6 mm) from Case for 10 s
Package Body for 10 s
T
300
260
°C
L
T
PKG
Drain
2
Operating Junction and
Storage Temperature Range
T , T
−55 to 150
°C
J
stg
Drain
1
3
Gate Source
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
A
Y
WW
G
= Location Code
= Year
= Work Week
= Pb−Free Package
1. Surface mounted on FR4 board using 1″ sq. pad size, 1 oz cu
2. Limited by maximum junction temperature
3. I = 4.0 A, di/dt ≤ 100 A/ms, V ≤ BV
, T = +150°C
J
SD
DD
DSS
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
June, 2009 − Rev. 0
NDF04N60Z/D