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MRF6S21050LR3 PDF预览

MRF6S21050LR3

更新时间: 2024-10-31 21:54:23
品牌 Logo 应用领域
飞思卡尔 - FREESCALE 晶体晶体管功率场效应晶体管射频
页数 文件大小 规格书
12页 427K
描述
RF Power Field Effect Transistors

MRF6S21050LR3 数据手册

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MRF6S21050L  
Rev. 0, 3/2005  
Freescale Semiconductor  
Technical Data  
RF Power Field Effect Transistors  
N-Channel Enhancement-Mode Lateral MOSFETs  
MRF6S21050LR3  
MRF6S21050LSR3  
Designed for W-CDMA base station applications with frequencies from 2110  
to 2170 MHz. Suitable for TDMA, CDMA and multicarrier amplifier applica-  
tions. To be used in Class AB for PCN - PCS/cellular radio and WLL  
applications.  
Typical 2-carrier W-CDMA Performance: VDD = 28 Volts, IDQ = 450 mA,  
Pout = 11.5 Watts Avg., Full Frequency Band, Channel Bandwidth =  
3.84 MHz, PAR = 8.5 dB @ 0.01% Probability on CCDF.  
Power Gain — 16 dB  
2170 MHz, 11.5 W AVG., 28 V  
2 x W-CDMA  
Drain Efficiency — 27.7%  
IM3 @ 10 MHz Offset — -37 dBc @ 3.84 MHz Channel Bandwidth  
ACPR @ 5 MHz Offset — -40 dBc @ 3.84 MHz Channel Bandwidth  
LATERAL N-CHANNEL  
RF POWER MOSFETs  
Capable of Handling 10:1 VSWR, @ 28 Vdc, 2140 MHz, 50 Watts CW  
Output Power  
Characterized with Series Equivalent Large-Signal Impedance Parameters  
Internally Matched, Controlled Q, for Ease of Use  
Qualified Up to a Maximum of 32 VDD Operation  
Integrated ESD Protection  
Designed for Lower Memory Effects and Wide Instantaneous Bandwidth  
CASE 465E-04, STYLE 1  
NI-400  
Applications  
Low Gold Plating Thickness on Leads, 40µNominal.  
MRF6S21050LR3  
In Tape and Reel. R3 Suffix = 250 Units per 32 mm, 13 inch Reel.  
CASE 465F-04, STYLE 1  
NI-400S  
MRF6S21050LSR3  
Table 1. Maximum Ratings  
Rating  
Symbol  
Value  
Unit  
Vdc  
Vdc  
Drain-Source Voltage  
Gate-Source Voltage  
V
DSS  
-0.5, +68  
-0.5, +12  
V
GS  
Total Device Dissipation @ T = 25°C  
Derate above 25°C  
P
D
151  
0.86  
W
W/°C  
C
Storage Temperature Range  
Operating Junction Temperature  
CW Operation  
T
- 65 to +150  
°C  
°C  
W
stg  
T
200  
50  
J
CW  
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and  
packaging MOS devices should be observed.  
Freescale Semiconductor, Inc., 2005. All rights reserved.  
 

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