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MGF4714CP PDF预览

MGF4714CP

更新时间: 2024-11-23 22:31:27
品牌 Logo 应用领域
三菱 - MITSUBISHI 晶体小信号场效应晶体管射频小信号场效应晶体管放大器
页数 文件大小 规格书
3页 21K
描述
PLASTIC MOLD PACKAGED LOW NOISE InGaAs HEMT

MGF4714CP 技术参数

生命周期:Obsolete包装说明:MICROWAVE, X-PXMW-F4
针数:4Reach Compliance Code:unknown
HTS代码:8541.21.00.95风险等级:5.78
Is Samacsys:N外壳连接:SOURCE
配置:SINGLE最大漏极电流 (Abs) (ID):0.06 A
最大漏极电流 (ID):0.06 AFET 技术:HIGH ELECTRON MOBILITY
最高频带:KU BANDJESD-30 代码:X-PXMW-F4
元件数量:1端子数量:4
工作模式:DEPLETION MODE最高工作温度:125 °C
封装主体材料:PLASTIC/EPOXY封装形状:UNSPECIFIED
封装形式:MICROWAVE极性/信道类型:N-CHANNEL
功耗环境最大值:0.05 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子形式:FLAT端子位置:UNSPECIFIED
晶体管应用:AMPLIFIER晶体管元件材料:GALLIUM ARSENIDE
Base Number Matches:1

MGF4714CP 数据手册

 浏览型号MGF4714CP的Datasheet PDF文件第2页浏览型号MGF4714CP的Datasheet PDF文件第3页 
MITSUBISHI SEMICONDUCTOR GaAs FET  
MGF4714CP  
PLASTIC MOLD PACKAGED LOW NOISE InGaAs HEMT  
DESCRIPTION  
Unit:millimeters  
OUTLINE DRAWING  
The MGF4714CP low-noise HEMT(High Electron Mobility  
Transistor) is designed for use in L to Ku band amplifiers.  
The plastic mold package offer high cost performance, and has a  
configuration suitable for microstrip circuits.  
(0.6)  
1
2
The MGF4714CP is mounted in Super 12 tape.  
FEATURES  
• Low noise figure  
2
(ø1.2)  
NFmin.=1.00dB(MAX.) @f=12GHz  
• High associated gain  
3
0.5±0.1  
Gs=11.0dB(MIN.)  
@f=12GHz  
APPLICATION  
L to Ku band low noise amplifiers.  
2.2±0.2  
(8˚)  
(R0.1) (R0.1)  
4.0±0.3  
QUALITY GRADE  
• GG  
RECOMMENDED BIAS CONDITIONS  
• VDS=2V,ID=10mA  
• Refer to Bias Procedure  
1
2
3
Gate  
Source  
Drain  
GD-22  
ABSOLUTE MAXIMUM RATINGS (Ta=25˚C)  
Symbol  
Parameter  
Ratings  
Unit  
V
V
VGDO  
Gate to drain voltage  
Gate to source voltage  
Drain current  
-4  
-4  
60  
VGSO  
ID  
mA  
mW  
˚C  
PT  
50  
Total power dissipation  
Channel temperature  
Storage temperature  
Tch  
Tstg  
125  
-65 to +125  
˚C  
ELECTRICAL CHARACTERISTICS (Ta=25˚C)  
Limits  
Symbol  
Parameter  
Test conditions  
Unit  
Min  
-3  
Typ  
Max  
V
µA  
mA  
V
IG=-10µA  
V(BR)GDO Gate to drain breakdown voltage  
50  
Gate to source leakage current  
15  
-0.1  
VGS=-2V,VDS=0V  
VGS=0V,VDS=2V  
VDS=2V,ID=500µA  
VDS=2V,ID=10mA  
IGSS  
60  
-1.5  
IDSS  
VGS(off)  
gm  
Saturated drain current  
Gate to source cut-off voltage  
55  
mS  
dB  
dB  
Transconductance  
Associated gain  
11.0  
GS  
NFmin.  
VDS=2V,ID=10mA  
f=12GHz  
Minimum noise figure  
1.00  
Nov. ´97  

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