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IXFH88N20Q PDF预览

IXFH88N20Q

更新时间: 2024-11-21 11:14:03
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IXYS /
页数 文件大小 规格书
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描述
HiPerFET Power MOSFETs

IXFH88N20Q 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-247AD
包装说明:PLASTIC PACKAGE-3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.76其他特性:AVALANCHE RATED
雪崩能效等级(Eas):2500 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (ID):88 A最大漏源导通电阻:0.03 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-247AD
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):352 A认证状态:Not Qualified
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管元件材料:SILICONBase Number Matches:1

IXFH88N20Q 数据手册

 浏览型号IXFH88N20Q的Datasheet PDF文件第2页浏览型号IXFH88N20Q的Datasheet PDF文件第3页浏览型号IXFH88N20Q的Datasheet PDF文件第4页 
HiPerFETTM  
Power MOSFETs  
IXFH 88N20Q  
IXFK 88N20Q  
IXFX 88N20Q  
VDSS = 200 V  
ID25 = 88 A  
RDS(on) = 30 mΩ  
200 ns  
trr  
N-ChannelEnhancementMode  
AvalancheRated, Highdv/dt, LowQg  
Preliminary data sheet  
Symbol  
TestConditions  
Maximum Ratings  
TO-247 AD (IXFH)  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MΩ  
200  
200  
V
V
VGS  
VGSM  
Continuous  
Transient  
±30  
±40  
V
V
D (TAB)  
TO-264 AA (IX
ID25  
IDM  
IAR  
TC = 25°C  
TC = 25°C, pulse width limited by TJM  
TC = 25°C  
88  
352  
88  
A
A
A
EAR  
EAS  
TC = 25°C  
TC = 25°C  
50  
2.5  
mJ  
J
G
D
S
D (TAB)  
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
,
20  
V/ns  
PLUS 247TM (IXFX)  
PD  
TC = 25°C  
500  
W
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
G
D
D (TAB)  
TL  
1.6 mm (0.063 in) from case for 10 s  
300  
°C  
G = Gate  
S = Source  
Md  
Mounting torque  
TO-247  
TO-264  
1.13/10 Nm/lb.in.  
0.9/6 Nm/lb.in.  
TAB = Drain  
Weight  
Symbol  
TO-247, PLUS 247  
TO-264  
6
10  
g
g
Features  
z Low gate charge  
z International standard packages  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
z
Epoxy meet UL 94 V-0, flammability  
classification  
z Low RDS (on) HDMOSTM process  
z Rugged polysilicon gate cell structure  
z Avalanche energy and current rated  
z Fast intrinsic Rectifier  
VDSS  
VGS = 0 V, ID = 250 uA  
VDS = VGS, ID = 4 mA  
200  
2.0  
V
V
VGS(th)  
4.0  
IGSS  
IDSS  
VGS = ±20 V DC, VDS = 0  
±100 nA  
25 µA  
Advantages  
VDS = VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
1
mA  
z
Easy to mount  
Space savings  
High power density  
RDS(on)  
VGS = 10 V, ID = 0.5 • ID25  
30 mΩ  
z
Pulse test, t 300 µs, duty cycle d 2 %  
z
© 2003 IXYS All rights reserved  
DS98969A(03/03)  

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