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IXFH8N80 PDF预览

IXFH8N80

更新时间: 2024-11-17 22:47:59
品牌 Logo 应用领域
IXYS 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
4页 204K
描述
HiPerFET Power MOSFETs - N-Channel Enhancement Mode High dv/dt, Low trr, HDMOSTM Family

IXFH8N80 技术参数

是否无铅: 不含铅生命周期:Transferred
零件包装代码:TO-247包装说明:FLANGE MOUNT, R-PSFM-T3
针数:3Reach Compliance Code:unknown
风险等级:5.74Is Samacsys:N
其他特性:AVALANCHE RATED外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:800 V
最大漏极电流 (Abs) (ID):8 A最大漏极电流 (ID):8 A
最大漏源导通电阻:1.1 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-247JESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL功耗环境最大值:180 W
最大功率耗散 (Abs):180 W最大脉冲漏极电流 (IDM):32 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
最大关闭时间(toff):300 ns最大开启时间(吨):210 ns
Base Number Matches:1

IXFH8N80 数据手册

 浏览型号IXFH8N80的Datasheet PDF文件第2页浏览型号IXFH8N80的Datasheet PDF文件第3页浏览型号IXFH8N80的Datasheet PDF文件第4页 
PreliminaryDataSheet  
VDSS  
ID25  
RDS(on)  
trr  
HiPerFETTM  
IXFH8N80 800V  
IXFH9N80 800V  
8A  
9A  
1.1Ω  
0.9Ω  
250 ns  
250 ns  
Power MOSFETs  
N-Channel Enhancement Mode  
High dv/dt, Low trr, HDMOSTM Family  
TO-247 AD (IXFH)  
Symbol  
TestConditions  
Maximum Ratings  
VDSS  
VDGR  
TJ = 25°C to 150°C  
800  
800  
V
V
TJ = 25°C to 150°C; RGS = 1 MΩ  
VGS  
Continuous  
Transient  
±20  
±30  
V
V
TO-247 SMD*  
VGSM  
ID25  
IDM  
IAR  
TC = 25°C  
8N80  
9N80  
8N80  
9N80  
8N80  
9N80  
8
9
32  
36  
8
A
A
A
A
A
A
TC = 25°C, pulse width limited by TJM  
TC = 25°C  
D (TAB)  
G
S
9
G = Gate  
D
= Drain  
EAR  
TC = 25°C  
18  
5
mJ  
S = Source  
TAB = Drain  
*Add suffix letter "S" for surface mountable  
package  
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
,
V/ns  
PD  
TC = 25°C  
180  
W
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
TJM  
Tstg  
Features  
-55 ... +150  
International standard packages  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
Unclamped Inductive Switching (UIS)  
rated  
Low package inductance  
- easy to drive and to protect  
Fast intrinsic Rectifier  
Md  
Mounting torque  
1.13/10 Nm/lb.in.  
Weight  
TO-204 = 18 g, TO-247 = 6 g  
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
Applications  
min. typ.  
max.  
DC-DC converters  
Battery chargers  
VDSS  
VGS = 0 V, ID = 3 mA  
800  
V
VDSS temperature coefficient  
0.088  
%/K  
Switched-mode and resonant-mode  
power supplies  
DC choppers  
VGS(th)  
VDS = VGS, ID = 2.5 mA  
2
4.5  
V
VGS(th) temperature coefficient  
-0.257  
%/K  
AC motor control  
Temperature and lighting controls  
IGSS  
IDSS  
VGS = ±20 VDC, VDS = 0  
±100 nA  
250 µA  
Advantages  
VDS = 0.8 • VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
1
mA  
Easy to mount with 1 screw (TO-247)  
(isolated mounting screw hole)  
Space savings  
RDS(on)  
VGS = 10 V, ID = 0.5 • ID25  
Pulse test, t 300 µs, duty cycle δ ≤ 2%  
8N80  
9N80  
1.1  
0.9  
High power density  
© 1997 IXYS All rights reserved  
96527A (8/97)  

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