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IXFH160N15T2 PDF预览

IXFH160N15T2

更新时间: 2024-11-18 12:35:35
品牌 Logo 应用领域
IXYS 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
6页 200K
描述
TrenchT2 HiperFET Power MOSFET

IXFH160N15T2 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-247
包装说明:FLANGE MOUNT, R-PSFM-T3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:8.48Is Samacsys:N
其他特性:AVALANCHE RATED雪崩能效等级(Eas):1500 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:150 V最大漏极电流 (Abs) (ID):160 A
最大漏极电流 (ID):160 A最大漏源导通电阻:0.009 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-247
JESD-30 代码:R-PSFM-T3JESD-609代码:e1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):880 W
最大脉冲漏极电流 (IDM):440 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IXFH160N15T2 数据手册

 浏览型号IXFH160N15T2的Datasheet PDF文件第2页浏览型号IXFH160N15T2的Datasheet PDF文件第3页浏览型号IXFH160N15T2的Datasheet PDF文件第4页浏览型号IXFH160N15T2的Datasheet PDF文件第5页浏览型号IXFH160N15T2的Datasheet PDF文件第6页 
Preliminary Technical Information  
TrenchT2TM HiperFETTM  
Power MOSFET  
VDSS = 150V  
ID25 = 160A  
IXFH160N15T2  
RDS(on) 9.0mΩ  
trr  
160ns  
N-Channel Enhancement Mode  
Avalanche Rated  
Fast Intrinsic Diode  
TO-247  
Symbol  
Test Conditions  
Maximum Ratings  
VDSS  
VDGR  
TJ = 25°C to 175°C  
TJ = 25°C to 175°C, RGS = 1MΩ  
150  
150  
V
V
VGSS  
VGSM  
Continuous  
Transient  
± 20  
± 30  
V
V
G
D
Tab  
S
ID25  
IDM  
TC = 25°C  
TC = 25°C, Pulse Width Limited by TJM  
160  
440  
A
A
G = Gate  
D
= Drain  
S = Source  
Tab = Drain  
IA  
EAS  
TC = 25°C  
TC = 25°C  
80  
1.5  
A
J
dv/dt  
PD  
IS IDM, VDD VDSS, TJ 175°C  
TC = 25°C  
15  
V/ns  
W
Features  
880  
z International Standard Package  
z High Current Handling Capability  
z Fast Intrinsic Diode  
TJ  
TJM  
Tstg  
-55 ... +175  
175  
-55 ... +175  
°C  
°C  
°C  
z Dynamaic dv/dt Rated  
z Avalanche Rated  
TL  
TSOLD  
Maximum Lead Temperature for Soldering  
Plastic Body for 10s  
300  
260  
°C  
°C  
z
Low RDS(on)  
Md  
Mounting Torque  
1.13/10  
6
Nm/lb.in.  
g
Weight  
Advantages  
z
Easy to Mount  
Space Savings  
High Power Density  
z
z
Applications  
Symbol  
Test Conditions  
Characteristic Values  
z DC-DC Converters  
z Battery Chargers  
(TJ = 25°C, Unless Otherwise Specified)  
Min.  
150  
2.5  
Typ.  
Max.  
BVDSS  
VGS(th)  
IGSS  
VGS = 0V, ID = 250µA  
VDS = VGS, ID = 1mA  
VGS = ± 20V, VDS = 0V  
VDS = VDSS, VGS= 0V  
V
V
z Switch-Mode and Resonant-Mode  
Power Supplies  
4.5  
z DC Choppers  
z AC Motor Drives  
z Uninterruptible Power Supplies  
z High Speed Power Switching  
Applications  
± 200 nA  
IDSS  
10 µA  
1 mA  
TJ = 150°C  
RDS(on)  
VGS = 10V, ID = 0.5 • ID25, Note 1  
7.7  
9.0 mΩ  
DS100228A(04/10)  
© 2010 IXYS CORPORATION, All Rights Reserved  

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