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IRLR8729PBF_09 PDF预览

IRLR8729PBF_09

更新时间: 2024-10-30 05:39:31
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
11页 348K
描述
HEXFETPower MOSFET

IRLR8729PBF_09 数据手册

 浏览型号IRLR8729PBF_09的Datasheet PDF文件第2页浏览型号IRLR8729PBF_09的Datasheet PDF文件第3页浏览型号IRLR8729PBF_09的Datasheet PDF文件第4页浏览型号IRLR8729PBF_09的Datasheet PDF文件第5页浏览型号IRLR8729PBF_09的Datasheet PDF文件第6页浏览型号IRLR8729PBF_09的Datasheet PDF文件第7页 
PD - 97352B  
IRLR8729PbF  
IRLU8729PbF  
HEXFET® Power MOSFET  
Applications  
l High Frequency Synchronous Buck  
Converters for Computer Processor Power  
l High Frequency Isolated DC-DC  
Converters with Synchronous Rectification  
for Telecom and Industrial Use  
VDSS RDS(on) max  
Qg  
10nC  
8.9m  
30V  
D
Benefits  
S
S
D
l Very Low RDS(on) at 4.5V VGS  
l Ultra-Low Gate Impedance  
l Fully Characterized Avalanche Voltage  
and Current  
G
G
D-Pak  
IRLR8729PbF  
I-Pak  
IRLU8729PbF  
l Lead-Free  
l RoHS compliant  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Parameter  
Max.  
30  
Units  
V
VDS  
Drain-to-Source Voltage  
V
Gate-to-Source Voltage  
± 20  
58  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
@ TC = 25°C  
@ TC = 100°C  
D
D
41  
A
260  
55  
DM  
Maximum Power Dissipation  
Maximum Power Dissipation  
P
P
@TC = 25°C  
@TC = 100°C  
W
D
D
27  
Linear Derating Factor  
Operating Junction and  
0.37  
-55 to + 175  
W/°C  
°C  
T
J
T
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
300 (1.6mm from case)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
–––  
–––  
Max.  
2.73  
50  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Ambient (PCB Mount)  
°C/W  
Junction-to-Ambient  
110  
ORDERING INFORMATION:  
See detailed ordering and shipping information on the last page of this data sheet.  
Notes  through are on page 11  
www.irf.com  
1
11/23/09  

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