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IRLR9343TRL PDF预览

IRLR9343TRL

更新时间: 2024-11-25 20:39:03
品牌 Logo 应用领域
英飞凌 - INFINEON 放大器脉冲晶体管
页数 文件大小 规格书
10页 240K
描述
Power Field-Effect Transistor, 20A I(D), 55V, 0.105ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, DPAK-3

IRLR9343TRL 数据手册

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PD - 95850  
DIGITAL AUDIO MOSFET  
IRLR9343  
IRLU9343  
IRLU9343-701  
Features  
l Advanced Process Technology  
Key Parameters  
l Key Parameters Optimized for Class-D Audio  
Amplifier Applications  
l Low RDSON for Improved Efficiency  
l Low Qg and Qsw for Better THD and Improved  
Efficiency  
l Low Qrr for Better THD and Lower EMI  
l 175°C Operating Junction Temperature for  
Ruggedness  
VDS  
RDS(ON) typ. @ VGS = -10V  
DS(ON) typ. @ VGS = -4.5V  
-55  
V
m:  
m:  
nC  
°C  
93  
R
150  
31  
Qg typ.  
TJ max  
175  
l Repetitive Avalanche Capability for Robustness and  
Reliability  
D
l Multiple Package Options  
D-Pak  
IRLR9343  
I-Pak  
IRLU9343  
G
I-Pak Leadform 701  
IRLU9343-701  
S
Refer to page 10 for package outline  
Description  
This Digital Audio HEXFET® is specifically designed for Class-D audio amplifier applications. This MosFET utilizes the latest  
processing techniques to achieve low on-resistance per silicon area. Furthermore, Gate charge, body-diode reverse recovery  
and internal Gate resistance are optimized to improve key Class-D audio amplifier performance factors such as efficiency, THD  
and EMI. Additional features of this MosFET are 175°C operating junction temperature and repetitive avalanche capability.  
These features combine to make this MosFET a highly efficient, robust and reliable device for Class-D audio amplifier  
applications.  
Absolute Maximum Ratings  
Parameter  
Drain-to-Source Voltage  
Max.  
-55  
±20  
-20  
-14  
-60  
79  
Units  
V
VDS  
VGS  
Gate-to-Source Voltage  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current c  
A
PD @TC = 25°C  
PD @TC = 100°C  
Power Dissipation  
Power Dissipation  
W
39  
Linear Derating Factor  
Operating Junction and  
Storage Temperature Range  
Clamping Pressure h  
0.53  
W/°C  
°C  
TJ  
-40 to + 175  
TSTG  
–––  
N
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
1.9  
Units  
Junction-to-Case g  
RθJC  
RθJA  
RθJA  
Junction-to-Ambient (PCB Mounted) gj  
Junction-to-Ambient (free air) g  
50  
°C/W  
110  
Notes  through ‰are on page 10  
www.irf.com  
1
4/1/04  

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