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IRLML6401GPBF PDF预览

IRLML6401GPBF

更新时间: 2024-11-20 05:39:31
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管开关脉冲光电二极管
页数 文件大小 规格书
8页 197K
描述
HEXFETPower MOSFET

IRLML6401GPBF 技术参数

是否Rohs认证:符合生命周期:Obsolete
包装说明:LEAD FREE, MICRO-3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.18
Is Samacsys:N雪崩能效等级(Eas):33 mJ
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:12 V
最大漏极电流 (Abs) (ID):4.3 A最大漏极电流 (ID):4.3 A
最大漏源导通电阻:0.05 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-236ABJESD-30 代码:R-PDSO-G3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):1.3 W最大脉冲漏极电流 (IDM):34 A
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRLML6401GPBF 数据手册

 浏览型号IRLML6401GPBF的Datasheet PDF文件第2页浏览型号IRLML6401GPBF的Datasheet PDF文件第3页浏览型号IRLML6401GPBF的Datasheet PDF文件第4页浏览型号IRLML6401GPBF的Datasheet PDF文件第5页浏览型号IRLML6401GPBF的Datasheet PDF文件第6页浏览型号IRLML6401GPBF的Datasheet PDF文件第7页 
PD - 96160  
IRLML6401GPbF  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l P-Channel MOSFET  
l SOT-23 Footprint  
l Low Profile (<1.1mm)  
l Available in Tape and Reel  
l Fast Switching  
VDSS = -12V  
RDS(on) = 0.05Ω  
l 1.8V Gate Rated  
l Lead-Free  
l Halogen-Free  
Description  
These P-Channel MOSFETs from International Rectifier  
utilize advanced processing techniques to achieve extremely  
low on-resistance per silicon area. This benefit, combined  
with the fast switching speed and ruggedized device design  
that HEXFET® power MOSFETs are well known for, provides  
the designer with an extremely efficient and reliable device  
for use in battery and load management.  
Micro3™  
A thermally enhanced large pad leadframe has been  
incorporated into the standard SOT-23 package to produce  
a HEXFET Power MOSFET with the industry's smallest  
footprint. This package, dubbed the Micro3, is ideal for  
applications where printed circuit board space is at a  
premium. The low profile (<1.1mm) of the Micro3 allows it  
to fit easily into extremely thin application environments  
suchasportableelectronicsandPCMCIAcards.Thethermal  
resistance and power dissipation are the best available.  
Absolute Maximum Ratings  
Parameter  
Drain- Source Voltage  
Max.  
-12  
Units  
V
VDS  
ID @ TA = 25°C  
ID @ TA= 70°C  
IDM  
Continuous Drain Current, VGS @ -4.5V  
Continuous Drain Current, VGS @ -4.5V  
Pulsed Drain Current   
-4.3  
-3.4  
A
-34  
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation  
1.3  
W
Power Dissipation  
0.8  
Linear Derating Factor  
0.01  
W/°C  
mJ  
V
EAS  
Single Pulse Avalanche Energy„  
Gate-to-Source Voltage  
33  
VGS  
± 8.0  
-55 to + 150  
TJ, TSTG  
Junction and Storage Temperature Range  
°C  
Thermal Resistance  
Parameter  
Typ.  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambientƒ  
75  
100  
°C/W  
www.irf.com  
1
07/22/08  

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