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IRHQ567110SCV PDF预览

IRHQ567110SCV

更新时间: 2024-11-07 14:51:35
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
13页 621K
描述
Power Field-Effect Transistor,

IRHQ567110SCV 技术参数

生命周期:Active包装说明:CHIP CARRIER, S-CQCC-N28
Reach Compliance Code:compliant风险等级:5.69
Is Samacsys:N雪崩能效等级(Eas):70 mJ
配置:SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):4.6 A最大漏极电流 (ID):4.6 A
最大漏源导通电阻:1.2 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:S-CQCC-N28元件数量:4
端子数量:28工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:SQUARE
封装形式:CHIP CARRIER极性/信道类型:N-CHANNEL AND P-CHANNEL
最大功率耗散 (Abs):12 W最大脉冲漏极电流 (IDM):18.4 A
参考标准:MIL-19500表面贴装:YES
端子形式:NO LEAD端子位置:QUAD
晶体管应用:SWITCHING晶体管元件材料:SILICON
最大关闭时间(toff):122 ns最大开启时间(吨):44 ns
Base Number Matches:1

IRHQ567110SCV 数据手册

 浏览型号IRHQ567110SCV的Datasheet PDF文件第2页浏览型号IRHQ567110SCV的Datasheet PDF文件第3页浏览型号IRHQ567110SCV的Datasheet PDF文件第4页浏览型号IRHQ567110SCV的Datasheet PDF文件第5页浏览型号IRHQ567110SCV的Datasheet PDF文件第6页浏览型号IRHQ567110SCV的Datasheet PDF文件第7页 
PD-94057E  
IRHQ567110  
100V, Combination 2N-2P CHANNEL  
RAD-Hard™ HEXFET®  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (LCC-28)  
R
TECHNOLOGY  
5
Product Summary  
Part Number  
IRHQ567110  
IRHQ563110  
IRHQ567110  
IRHQ563110  
Radiation Level  
100 kRads(Si)  
300 kRads(Si)  
100 kRads(Si)  
300 kRads(Si)  
RDS(on)  
ID  
Channel  
4.6A  
4.6A  
-2.8A  
-2.8A  
N
N
P
P
0.27  
0.29  
0.96  
0.98  
Features  
Single Event Effect (SEE) Hardened  
Low RDS(on)  
Low Total Gate Charge  
Simple Drive Requirements  
Hermetically Sealed  
Ceramic Package  
Surface Mount  
Light Weight  
ESD Rating: Class 1A per MIL-STD-750, Method 1020  
Description  
IR HiRel RAD-Hard™ HEXFET® MOSFET Technology  
provides high performance power MOSFETs for space  
applications. This technology has over a decade of proven  
performance and reliability in satellite applications. These  
devices have been characterized for both Total Dose and  
Single Event Effects (SEE). The combination of low RDS(on)  
and low gate charge reduces the power losses in switching  
applications such as DC to DC converters and motor control.  
These devices retain all of the well established advantages  
of MOSFETs such as voltage control, fast switching and  
temperature stability of electrical parameters.  
Absolute Maximum Ratings (Per Die)  
Pre-Irradiation  
Symbol  
N-Channel  
Parameter  
P-Channel  
Units  
ID1 @ VGS = ±12V, TC = 25°C  
Continuous Drain Current  
4.6  
-2.8  
A
ID2 @ VGS = ±12V, TC = 100°C Continuous Drain Current  
2.9  
18.4  
12  
-1.8  
-11.2  
12  
IDM @TC = 25°C  
PD @TC = 25°C  
Pulsed Drain Current  
W
W/°C  
V
Maximum Power Dissipation  
Linear Derating Factor  
0.1  
0.1  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
± 20  
47  
4.6  
± 20  
70  
-2.8  
1.2  
Single Pulse Avalanche Energy   
Avalanche Current   
mJ  
A
mJ  
V/ns  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy   
Peak Diode Recovery dv/dt  
Operating Junction and  
1.2  
6.1  
-7.1  
-55 to +150  
TSTG  
Storage Temperature Range  
°C  
g
Package Mounting Surface Temp.  
Weight  
300 ( for 5s)  
0.89 (Typical)  
For Footnotes, refer to the page 2 for N Channel and page 3 for P Channel  
1
2019-01-15  
International Rectifier HiRel Products, Inc.  

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