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IRHQ57214SE PDF预览

IRHQ57214SE

更新时间: 2024-11-20 03:36:55
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 178K
描述
RADIATION HARDENED POWER MOSFET SURFACE MOUNT (LCC-28)

IRHQ57214SE 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:HERMETIC SEALED, LCC-28Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.34
雪崩能效等级(Eas):30 mJ配置:SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:250 V最大漏极电流 (Abs) (ID):1.9 A
最大漏极电流 (ID):1.9 A最大漏源导通电阻:1.5 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-CQCC-N28
JESD-609代码:e0元件数量:4
端子数量:28工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:SQUARE封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):12 W最大脉冲漏极电流 (IDM):7.6 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:NO LEAD端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IRHQ57214SE 数据手册

 浏览型号IRHQ57214SE的Datasheet PDF文件第2页浏览型号IRHQ57214SE的Datasheet PDF文件第3页浏览型号IRHQ57214SE的Datasheet PDF文件第4页浏览型号IRHQ57214SE的Datasheet PDF文件第5页浏览型号IRHQ57214SE的Datasheet PDF文件第6页浏览型号IRHQ57214SE的Datasheet PDF文件第7页 
                                                                         
PD-93881C  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (LCC-28)  
IRHQ57214SE  
250V, QUAD N-CHANNEL  
TECHNOLOGY  
5
™
Product Summary  
Part Number Radiation Level RDS(on)  
IRHQ57214SE 100K Rads (Si) 1.5Ω  
ID  
1.9A  
LCC-28  
International Rectifier’s R5TM technology provides  
high performance power MOSFETs for space  
applications. These devices have been characterized  
for Single Event Effects(SEE) with useful  
performance up to an LET of 80 (MeV/(mg/cm2)). The  
combination of low RDS(on) and low gate charge  
reduces the power losses in switching applications  
such as DC to DC converters and motor control.  
These devices retain all of the well established  
advantages of MOSFETs such as voltage control, fast  
switching, ease of paralleling and temperature  
stability of electrical parameters.  
Features:  
n
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Low RDS(on)  
Low Total Gate Charge  
ProtonTolerant  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Surface Mount  
n Light Weight  
Pre-Irradiation  
Absolute Maximum Ratings (Per Die)  
Parameter  
Units  
I
@ V  
@ V  
= 12V, T = 25°C  
Continuous Drain Current  
1.9  
1.2  
D
D
GS  
GS  
C
A
I
= 12V, T = 100°C Continuous Drain Current  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
7.6  
DM  
@ T = 25°C  
P
D
12  
W
W/°C  
V
C
0.1  
V
Gate-to-Source Voltage  
Single PulseAvalanche Energy Á  
Avalanche Current À  
±20  
30  
GS  
E
AS  
mJ  
A
I
1.9  
AR  
E
RepetitiveAvalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
1.2  
mJ  
V/ns  
AR  
dv/dt  
9.9  
T
-55 to 150  
J
oC  
g
T
STG  
Storage Temperature Range  
Pckg. Mounting Surface Temp.  
Weight  
300 (for 5s)  
0.89 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
05/19/05  

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