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IRHQ57110PBF PDF预览

IRHQ57110PBF

更新时间: 2024-11-21 05:06:27
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
8页 175K
描述
Power Field-Effect Transistor, 4.6A I(D), 100V, 0.31ohm, 4-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, CERAMIC, LCC-28

IRHQ57110PBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:CHIP CARRIER, S-CQCC-N28Reach Compliance Code:compliant
风险等级:5.7雪崩能效等级(Eas):47 mJ
配置:SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (ID):4.6 A最大漏源导通电阻:0.31 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-CQCC-N28
元件数量:4端子数量:28
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:SQUARE
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大脉冲漏极电流 (IDM):18.4 A
表面贴装:YES端子形式:NO LEAD
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRHQ57110PBF 数据手册

 浏览型号IRHQ57110PBF的Datasheet PDF文件第2页浏览型号IRHQ57110PBF的Datasheet PDF文件第3页浏览型号IRHQ57110PBF的Datasheet PDF文件第4页浏览型号IRHQ57110PBF的Datasheet PDF文件第5页浏览型号IRHQ57110PBF的Datasheet PDF文件第6页浏览型号IRHQ57110PBF的Datasheet PDF文件第7页 
                                                                         
PD-94211E  
IRHQ57110  
100V, Quad N-CHANNEL  
TECHNOLOGY  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (LCC-28)  
5
™
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
IRHQ57110  
IRHQ53110  
IRHQ54110  
100K Rads (Si)  
300K Rads (Si)  
500K Rads (Si)  
0.27Ω  
0.27Ω  
0.27Ω  
0.29Ω  
4.6A  
4.6A  
4.6A  
4.6A  
LCC-28  
IRHQ58110 1000K Rads (Si)  
Features:  
International Rectifier’s R5TM technology provides high  
performance power MOSFETs for space applications.  
These devices have been characterized for Single Event  
Effects (SEE) with useful performance up to an LET of  
80 (MeV/(mg/cm2)). The combination of low RDS(on) and  
low gate charge reduces the power losses in switching  
applications such as DC to DC converters and motor  
control. These devices retain all of the well established  
advantages of MOSFETs such as voltage control, fast  
switching, ease of paralleling and temperature stability  
of electrical parameters.  
n
n
n
n
n
n
n
n
n
n
Single Event Effect (SEE) Hardened  
Low RDS(on)  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Surface Mount  
Light Weight  
ESD Rating: Class 1A per MIL-STD-750,  
Method 1020  
Absolute Maximum Ratings (Per Die)  
Parameter  
Pre-Irradiation  
Units  
I
@ V  
= 12V, T = 25°C  
Continuous Drain Current  
4.6  
D
GS  
GS  
C
I
D
@ V  
= 12V, T = 100°C Continuous Drain Current  
2.9  
18.4  
12  
A
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
DM  
@ T = 25°C  
P
W
W/°C  
V
D
C
Linear Derating Factor  
0.1  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
±20  
GS  
E
47  
mJ  
A
AS  
I
4.6  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
1.2  
mJ  
V/ns  
AR  
dv/dt  
6.1  
T
-55 to 150  
J
T
Storage Temperature Range  
°C  
g
STG  
Pckg. Mounting Surface Temp.  
Weight  
300 (for 5s)  
0.89 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
05/0115  

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