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IRHQ567110

更新时间: 2024-11-07 03:36:55
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
14页 196K
描述
RADIATION HARDENED 100V, COMBINATION 2N-2P-CHANNEL POWER MOSFET SURFACE MOUNT (LCC-28)

IRHQ567110 技术参数

是否Rohs认证:不符合生命周期:Active
包装说明:CHIP CARRIER, S-CQCC-N28Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.18
Is Samacsys:N雪崩能效等级(Eas):70 mJ
配置:SEPARATE, 4 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):4.6 A最大漏极电流 (ID):4.6 A
最大漏源导通电阻:1.2 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:S-CQCC-N28JESD-609代码:e0
元件数量:4端子数量:28
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装形状:SQUARE封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL AND P-CHANNEL
最大功率耗散 (Abs):12 W最大脉冲漏极电流 (IDM):18.4 A
认证状态:Not Qualified参考标准:RH - 100K Rad(Si)
子类别:Other Transistors表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:NO LEAD
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
最大关闭时间(toff):122 ns最大开启时间(吨):44 ns
Base Number Matches:1

IRHQ567110 数据手册

 浏览型号IRHQ567110的Datasheet PDF文件第2页浏览型号IRHQ567110的Datasheet PDF文件第3页浏览型号IRHQ567110的Datasheet PDF文件第4页浏览型号IRHQ567110的Datasheet PDF文件第5页浏览型号IRHQ567110的Datasheet PDF文件第6页浏览型号IRHQ567110的Datasheet PDF文件第7页 
PD - 94057B  
IRHQ567110  
100V, Combination 2N-2P-CHANNEL  
RAD-HardHEXFET®  
RADIATION HARDENED  
POWER MOSFET  
TECHNOLOGY  
SURFACE MOUNT (LCC-28)  
R
5
Product Summary  
Part Number Radiation Level RDS(on)  
IRHQ567110 100K Rads (Si) 0.27Ω  
IRHQ563110 300K Rads (Si) 0.29Ω  
ID  
CHANNEL  
4.6A  
4.6A  
-2.8A  
-2.8A  
N
N
P
P
IRHQ567110 100K Rads (Si)  
IRHQ563110 300K Rads (Si)  
0.96Ω  
0.98Ω  
LCC-28  
International Rectifier’s RAD-HardTM HEXFET® MOSFET  
Technology provides high performance power MOSFETs  
for space applications. This technology has over a decade  
of proven performance and reliability in satellite applica-  
tions. These devices have been characterized for both  
Total Dose and Single Event Effects (SEE). The combina-  
tion of low RDS(on) and low gate charge reduces the power  
losses in switching applications such as DC to DC con-  
verters and motor control. These devices retain all of the  
well established advantages of MOSFETs such as voltage  
control, fast switching, ease of paralleling and tempera-  
ture stability of electrical parameters.  
Features:  
n
Single Event Effect (SEE) Hardened  
n
n
n
n
n
n
n
n
n
Low RDS(on)  
Low Total Gate Charge  
Proton Tolerant  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Surface Mount  
Light Weight  
Pre-Irradiation  
Absolute Maximum Ratings ( Per Die)  
Parameter  
= ±12V, T = 25°C Continuous Drain Current  
C
N-Channel  
4.6  
P-Channel  
-2.8  
Units  
I
@ V  
@ V  
D
GS  
A
I
= ±12V, T = 100°C Continuous Drain Current  
2.9  
-1.8  
D
GS  
C
I
Pulsed Drain Current  
Max. Power Dissipation  
Linear Derating Factor  
18.4  
12  
-11.2  
12  
DM  
@ T = 25°C  
P
W
W/°C  
V
D
C
0.1  
0.1  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy  
Avalanche Current ➀  
±20  
±20  
GS  
E
47 ➀  
4.6  
70➀  
-2.8  
mJ  
A
AS  
I
AR  
E
Repetitive Avalanche Energy ➀  
Peak Diode Recovery dv/dt  
Operating Junction  
1.2  
1.2  
mJ  
V/ns  
AR  
dv/dt  
6.1 ➀  
7.1 ➀  
T
-55 to 150  
J
T
Storage Temperature Range  
oC  
g
STG  
Pckg. Mounting Surface Temp.  
Weight  
300 (for 5s)  
0.89 (Typical)  
For footnotes refer to the last page  
www.irf.com  
1
07/25/01  

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