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IRHMK597160 PDF预览

IRHMK597160

更新时间: 2024-11-20 03:42:19
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 171K
描述
RADIATION HARDENED POWER MOSFET SURFACE MOUNT (Low-Ohmic TO-254AA)

IRHMK597160 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:HERMETIC SEALED, TABLESS TO-254AA, 3 PINReach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.32
雪崩能效等级(Eas):480 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):45 A
最大漏极电流 (ID):45 A最大漏源导通电阻:0.05 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-254AA
JESD-30 代码:R-XSIP-T3JESD-609代码:e0
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):208 W
最大脉冲漏极电流 (IDM):180 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:NO
端子面层:TIN LEAD端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON

IRHMK597160 数据手册

 浏览型号IRHMK597160的Datasheet PDF文件第2页浏览型号IRHMK597160的Datasheet PDF文件第3页浏览型号IRHMK597160的Datasheet PDF文件第4页浏览型号IRHMK597160的Datasheet PDF文件第5页浏览型号IRHMK597160的Datasheet PDF文件第6页浏览型号IRHMK597160的Datasheet PDF文件第7页 
                                                                            
PD-96912  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (Low-Ohmic TO-254AA)  
IRHMK597160  
100V, N-CHANNEL  
TECHNOLOGY  
5
™
Product Summary  
Part Number Radiation Level RDS(on)  
ID  
IRHMK597160 100K Rads (Si)  
IRHMK593160 300K Rads (Si)  
0.05-45A*  
0.05-45A*  
Low-Ohmic  
TO-254AA Tabless  
International Rectifier’s R5TM technology provides  
high performance power MOSFETs for space  
applications. These devices have been characterized  
for Single Event Effects (SEE) with useful performance  
up to an LET of 80 (MeV/(mg/cm2)). The combination  
of low RDS(on) and low gate charge reduces the power  
losses in switching applications such as DC to DC  
converters and motor control. These devices retain  
all of the well established advantages of MOSFETs  
such as voltage control, fast switching, ease of  
paralleling and temperature stability of electrical  
parameters.  
Features:  
n
n
n
n
n
n
n
n
n
n
Low RDS(on)  
Fast Switching  
Single Event Effect (SEE) Hardened  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Eyelets  
Electrically Isolated  
Light Weight  
Absolute Maximum Ratings  
Pre-Irradiation  
Parameter  
Units  
I
@ V  
@ V  
= -12V, T = 25°C Continuous Drain Current  
-45*  
-30  
D
D
GS  
GS  
C
A
I
= -12V, T = 100°C Continuous Drain Current  
C
I
Pulsed Drain Current À  
Max. Power Dissipation  
Linear Derating Factor  
-180  
208  
DM  
@ T = 25°C  
P
D
W
W/°C  
V
C
1.67  
±20  
V
Gate-to-Source Voltage  
Single Pulse Avalanche Energy Á  
Avalanche Current À  
GS  
E
480  
mJ  
A
AS  
I
-45  
AR  
E
Repetitive Avalanche Energy À  
Peak Diode Recovery dv/dt   
Operating Junction  
20.8  
-6.0  
mJ  
V/ns  
AR  
dv/dt  
T
-55 to 150  
J
oC  
g
T
Storage Temperature Range  
STG  
Pack. Mounting Surface Temp.  
Weight  
300 (for 5s)  
3.7 (Typical)  
* Current is limited by package  
For footnotes refer to the last page  
www.irf.com  
1
12/24/04  

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