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IRG4PC50UDPBF PDF预览

IRG4PC50UDPBF

更新时间: 2024-11-21 03:24:19
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体二极管双极型晶体管功率控制双极性晶体管局域网超快软恢复二极管快速软恢复二极管
页数 文件大小 规格书
10页 688K
描述
INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE

IRG4PC50UDPBF 技术参数

是否Rohs认证: 符合生命周期:End Of Life
包装说明:FLANGE MOUNT, R-PSFM-T3Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.19
Is Samacsys:N其他特性:ULTRA FAST SOFT RECOVERY
外壳连接:COLLECTOR最大集电极电流 (IC):55 A
集电极-发射极最大电压:600 V配置:SINGLE WITH BUILT-IN DIODE
门极发射器阈值电压最大值:6 V门极-发射极最大电压:20 V
JEDEC-95代码:TO-247ACJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):200 W认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:POWER CONTROL
晶体管元件材料:SILICON标称断开时间 (toff):370 ns
标称接通时间 (ton):71 nsBase Number Matches:1

IRG4PC50UDPBF 数据手册

 浏览型号IRG4PC50UDPBF的Datasheet PDF文件第2页浏览型号IRG4PC50UDPBF的Datasheet PDF文件第3页浏览型号IRG4PC50UDPBF的Datasheet PDF文件第4页浏览型号IRG4PC50UDPBF的Datasheet PDF文件第5页浏览型号IRG4PC50UDPBF的Datasheet PDF文件第6页浏览型号IRG4PC50UDPBF的Datasheet PDF文件第7页 
PD -95185  
IRG4PC50UDPbF  
UltraFast CoPack IGBT  
INSULATED GATE BIPOLAR TRANSISTOR WITH  
ULTRAFAST SOFT RECOVERY DIODE  
Features  
C
• UltraFast: Optimized for high operating  
frequencies 8-40 kHz in hard switching, >200  
kHz in resonant mode  
VCES = 600V  
• Generation 4 IGBT design provides tighter  
V
CE(on) typ. = 1.65V  
parameter distribution and higher efficiency than  
Generation 3  
G
@VGE = 15V, IC = 27A  
• IGBT co-packaged with HEXFREDTM ultrafast,  
ultra-soft-recovery anti-parallel diodes for use in  
bridge configurations  
E
n-channel  
• Industry standard TO-247AC package  
• Lead-Free  
Benefits  
• Generation 4 IGBT's offer highest efficiencies  
available  
• IGBT's optimized for specific application conditions  
• HEXFRED diodes optimized for performance with  
IGBT's . Minimized recovery characteristics require  
less/no snubbing  
• Designed to be a "drop-in" replacement for  
equivalent industry-standard Generation 3 IR IGBT's  
TO-247AC  
Absolute Maximum Ratings  
Parameter  
Max.  
600  
Units  
V
VCES  
Collector-to-Emitter Voltage  
Continuous Collector Current  
Continuous Collector Current  
Pulsed Collector Current   
IC @ TC = 25°C  
55  
IC @ TC = 100°C  
27  
ICM  
220  
A
ILM  
Clamped Inductive Load Current ‚  
Diode Continuous Forward Current  
Diode Maximum Forward Current  
Gate-to-Emitter Voltage  
220  
IF @ TC = 100°C  
25  
IFM  
220  
VGE  
± 20  
200  
V
PD @ TC = 25°C  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction and  
W
PD @ TC = 100°C  
78  
TJ  
-55 to +150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 sec.  
Mounting Torque, 6-32 or M3 Screw.  
°C  
300 (0.063 in. (1.6mm) from case)  
10 lbf•in (1.1 N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case - IGBT  
Junction-to-Case - Diode  
Case-to-Sink, flat, greased surface  
Junction-to-Ambient, typical socket mount  
Weight  
Min.  
------  
------  
------  
-----  
Typ.  
------  
------  
0.24  
Max.  
0.64  
0.83  
------  
40  
Units  
RθJC  
RθJC  
RθCS  
RθJA  
Wt  
°C/W  
-----  
------  
6 (0.21)  
------  
g (oz)  
www.irf.com  
1
04/23/04  

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