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IRG4PC60F-P PDF预览

IRG4PC60F-P

更新时间: 2024-11-21 04:44:39
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率控制双极性晶体管局域网
页数 文件大小 规格书
8页 119K
描述
INSULATED GATE BIPOLAR TRANSISTOR Fast Speed IGBT

IRG4PC60F-P 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:TO-3P, 3 PINReach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.61
外壳连接:COLLECTOR最大集电极电流 (IC):90 A
集电极-发射极最大电压:600 V配置:SINGLE
JEDEC-95代码:TO-247ACJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):250极性/信道类型:N-CHANNEL
认证状态:Not Qualified表面贴装:NO
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):770 ns标称接通时间 (ton):105 ns
Base Number Matches:1

IRG4PC60F-P 数据手册

 浏览型号IRG4PC60F-P的Datasheet PDF文件第2页浏览型号IRG4PC60F-P的Datasheet PDF文件第3页浏览型号IRG4PC60F-P的Datasheet PDF文件第4页浏览型号IRG4PC60F-P的Datasheet PDF文件第5页浏览型号IRG4PC60F-P的Datasheet PDF文件第6页浏览型号IRG4PC60F-P的Datasheet PDF文件第7页 
PD - 94440  
IRG4PC60F-P  
Fast Speed IGBT  
INSULATED GATE BIPOLAR TRANSISTOR  
C
Features  
VCES =600V  
• Fast: Optimized for medium operating  
frequencies ( 1-5 kHz in hard switching, >20  
kHz in resonant mode).  
VCE(on)typ. = 1.50V  
G
• Generation 4 IGBT design provides tighter  
parameter distribution and higher efficiency.  
• Solder plated version of industry standard  
TO-247AC package.  
@VGE = 15V, IC = 60A  
E
n-channel  
Benefits  
• Generation 4 IGBT's offer highest efficiency available.  
• IGBT's optimized for specified application conditions.  
• Solder plated version of the TO-247 allows the reflow  
soldering of the package heatsink to a substrate material.  
• Designed for best performance when used with IR  
HEXFRED & IR FRED companion diodes.  
TO-247AC  
Absolute Maximum Ratings  
Parameter  
Max.  
600  
90  
Units  
V
VCES  
Collector-to-Emitter Breakdown Voltage  
Continuous Collector Current  
Continuous Collector Current  
Pulsed Collector Current   
IC @ TC = 25°C  
IC @ TC = 100°C  
60  
A
ICM  
120  
120  
± 20  
200  
520  
210  
ILM  
Clamped Inductive Load Current ‚  
Gate-to-Emitter Voltage  
VGE  
V
EARV  
Reverse Voltage Avalanche Energy ƒ  
Maximum Power Dissipation  
mJ  
PD @ TC = 25°C  
W
PD @ TC = 100°C  
Maximum Power Dissipation  
TJ  
Operating Junction and  
-55 to + 150  
TSTG  
Storage Temperature Range  
°C  
°C  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw  
Maximum Reflow Temperature ‡  
300 (0.063 in. (1.6mm from case )  
10 lbf•in (1.1N•m)  
230 (Time above 183°C  
should not exceed 100s)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
Max.  
0.24  
–––  
40  
Units  
RθJC  
RθCS  
RθJA  
RθJA  
Wt  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient (Typical Socket Mount)  
Junction-to-Ambient (PCB Mount, Steady State)†  
Weight  
0.24  
°C/W  
–––  
–––  
20  
6 (0.21)  
–––  
g (oz)  
www.irf.com  
1
04/26/02  

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