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IRFS4321-7PPBF_15 PDF预览

IRFS4321-7PPBF_15

更新时间: 2024-09-15 01:13:35
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
10页 410K
描述
Motion Control Applications

IRFS4321-7PPBF_15 数据手册

 浏览型号IRFS4321-7PPBF_15的Datasheet PDF文件第2页浏览型号IRFS4321-7PPBF_15的Datasheet PDF文件第3页浏览型号IRFS4321-7PPBF_15的Datasheet PDF文件第4页浏览型号IRFS4321-7PPBF_15的Datasheet PDF文件第5页浏览型号IRFS4321-7PPBF_15的Datasheet PDF文件第6页浏览型号IRFS4321-7PPBF_15的Datasheet PDF文件第7页 
IRFS4321-7PPbF  
HEXFET® Power MOSFET  
Application  
Motion Control Applications  
VDSS  
150V  
High Efficiency Synchronous Rectification in SMPS  
Uninterruptible Power Supply  
Hard Switched and High Frequency Circuits  
RDS(on) typ.  
11.7m  
14.7m  
max  
ID  
86A  
Benefits  
Low Rdson Reduces Losses  
Low Gate Charge Improves the Switching Performance  
Improved Diode Recovery Improves Switching &  
EMI Performance  
30V Gate Voltage Rating Improves Robustness  
Fully Characterized Avalanche SOA  
D2Pak 7Pin  
G
D
S
Gate  
Drain  
Source  
Standard Pack  
Form  
Tube  
Orderable Part Number  
Base part number Package Type  
Quantity  
50  
IRFS4321-7PPbF  
D2Pak-7Pin  
IRFS4321-7PPbF  
IRFS4321TRL7PP  
Tape and Reel Left  
800  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current   
86  
61  
A
343  
350  
2.3  
PD @TC = 25°C  
Maximum Power Dissipation  
Linear Derating Factor  
W
W/°C  
V
VGS  
Gate-to-Source Voltage  
± 30  
120  
EAS (Thermally limited)  
Single Pulse Avalanche Energy   
mJ  
TJ  
TSTG  
Operating Junction and  
-55 to + 175  
300  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
°C  
Thermal Resistance  
Parameter  
Junction-to-Case   
Typ.  
–––  
–––  
Max.  
0.43*  
40  
Units  
°C/W  
RJC  
RJA  
Junction-to-Ambient   
RJC (end of life) for D2Pak and TO-262 = 0.65°C/W. This is the maximum measured value after 1000 temperature  
cycles from -55 to 150°C and is accounted for by the physical wear out of the die attach medium.  
Notes through are on page 2  
1
www.irf.com  
© 2013 International Rectifier  
June 14, 2013  

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