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IRFS4228PBF

更新时间: 2024-09-11 01:19:55
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
10页 376K
描述
Advanced Process Technology

IRFS4228PBF 数据手册

 浏览型号IRFS4228PBF的Datasheet PDF文件第2页浏览型号IRFS4228PBF的Datasheet PDF文件第3页浏览型号IRFS4228PBF的Datasheet PDF文件第4页浏览型号IRFS4228PBF的Datasheet PDF文件第5页浏览型号IRFS4228PBF的Datasheet PDF文件第6页浏览型号IRFS4228PBF的Datasheet PDF文件第7页 
PD - 97231A  
IRFS4228PbF  
PDP SWITCH  
IRFSL4228PbF  
Features  
Key Parameters  
l
Advanced Process Technology  
Key Parameters Optimized for PDP  
Sustain, Energy Recovery and Pass  
Switch Applications  
l
VDS min  
150  
180  
12  
V
V
m
V
DS (Avalanche) typ.  
RDS(ON) typ. @ 10V  
IRP max @ TC= 100°C  
TJ max  
l
Low EPULSE Rating to Reduce Power  
Dissipation in PDP Sustain, Energy  
Recovery and Pass Switch Applications  
Low QG for Fast Response  
High Repetitive Peak Current Capability for  
Reliable Operation  
170  
175  
A
°C  
l
l
D
D
D
l
Short Fall & Rise Times for Fast Switching  
S
l
175°C Operating Junction Temperature for  
Improved Ruggedness  
D
S
G
D
G
G
D2Pak  
IRFS4228PbF  
l
Repetitive Avalanche Capability for  
Robustness and Reliability  
TO-262  
IRFSL4228PbF  
S
G
D
S
Gate  
Drain  
Source  
Description  
This HEXFET® Power MOSFET is specifically designed for Sustain; Energy Recovery & Pass switch  
applicationsinPlasmaDisplayPanels. ThisMOSFETutilizesthelatestprocessingtechniquestoachieve  
low on-resistance per silicon area and low EPULSE rating. Additional features of this MOSFET are 175°C  
operating junction temperature and high repetitive peak current capability. These features combine to  
make this MOSFET a highly efficient, robust and reliable device for PDP driving applications.  
Absolute Maximum Ratings  
Max.  
±30  
Parameter  
Units  
V
VGS  
Gate-to-Source Voltage  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
83  
A
59  
330  
IRP @ TC = 100°C  
PD @TC = 25°C  
PD @TC = 100°C  
170  
Repetitive Peak Current  
330  
Power Dissipation  
W
170  
Power Dissipation  
2.2  
Linear Derating Factor  
W/°C  
°C  
TJ  
-40 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature for 10 seconds  
Mounting Torque, 6-32 or M3 Screw  
300  
10lb in (1.1N m)  
N
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
Max.  
Units  
°C/W  
Junction-to-Case  
*
Rθ  
0.45  
40  
JC  
Junction-to-Ambient (PCB Mount) , D2Pak  
RθJA  
* RθJC (end of life) for D2Pak and TO-262 = 0.65°C/W. This is the maximum measured value after 1000 temperature  
cycles from -55 to 150°C and is accounted for by the physical wearout of the die attach medium.  
Notes  through †are on page 10  
www.irf.com  
1
09/14/07  

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